Every parent is concerned when a child is slow to become a mature adult. This is also true for any product designer, regardless of their industry sector. For a product to be mature, it must have an expected level of reliability from the moment it is put into service, and must maintain this level throughout its industrial use. While there have been theoretical and practical advances in reliability from the 1960s to the end of the 1990s, to take into account the effect of maintenance, the maturity of a product is often only partially addressed. Product Maturity 1 fills this gap as much as…mehr
Every parent is concerned when a child is slow to become a mature adult. This is also true for any product designer, regardless of their industry sector. For a product to be mature, it must have an expected level of reliability from the moment it is put into service, and must maintain this level throughout its industrial use.
While there have been theoretical and practical advances in reliability from the 1960s to the end of the 1990s, to take into account the effect of maintenance, the maturity of a product is often only partially addressed.
Product Maturity 1 fills this gap as much as possible; a difficult exercise given that maturity is a transverse activity in the engineering sciences; it must be present throughout the lifecycle of a product.
Franck Bayle is an electronic engineer by training. He has practiced for almost 15 years, working at Crouzet and then at Thales in Valence, France. He has also worked in reliability and maturity.
Inhaltsangabe
Foreword by Laurent Denis ix
Foreword by Serge Zaninotti xiii
Acknowledgements xv
Introduction xvii
Chapter 1. Reliability Review 1
1.1. Failure rate 1
1.2. Temperature effect 6
1.3. Effect of maintenance 6
1.4. MTBF 7
1.5. Nature of the reliability objective 9
Chapter 2. Maturity 11 Serge ZANINOTTI
2.1. Context 11
2.2. Normative context and its implications 13
2.2.1. Quality standards 13
2.2.2. Quality management system and product quality 13
2.2.3. Product quality and dependability 16
2.2.4. Product dependability and maturity 18
2.2.5. Standards in various domains 23
2.2.6. Perspectives 24
2.3. Building of maturity 28
2.4. Confirmation of maturity 30
Chapter 3. Derating Analysis 33
3.1. Derating 33
3.2. Rules provided by the manufacturers of components 34
3.2.1. CMS resistors 34
3.2.2. Capacitors 38
3.2.3. Magnetic circuits 41
3.2.4. Fuses 41
3.2.5. Resonators 42
3.2.6. Oscillators 42
3.2.7. Photocouplers 42
3.2.8. Diodes 43
3.2.9. Zener diodes 43
3.2.10. Tranzorb diodes 43
3.2.11. Low power bipolar transistors 45
3.2.12. Power bipolar transistors 45
3.2.13. Low power MOSFET transistors 46
3.2.14. High power MOSFET transistors 46
3.2.15. Integrated circuits 47
3.3. Reference-based approach 47
3.4. Creation of derating rules 49
3.4.1. Rules for constant temperature 53
3.4.2. Rule for voltage 58
3.5. Summary 59
Chapter 4. Components with Limited Service Life 61
4.1. RDF 2000 guide 63
4.1.1. Power transistor 63
4.1.2. Photocouplers 64
4.1.3. Switch or push button 64
4.1.4. Connectors 65
4.2. FIDES 2009 guide 65
4.2.1. Fans 66
4.2.2. Batteries 66
4.3. Manufacturer's data 68
4.3.1. Wet electrolytic capacitor 68
4.3.2. Connectors 71
4.3.3. Relays 72
4.3.4. Optocouplers 73
4.3.5. Batteries 76
4.3.6. Fans 77
4.3.7. Flash memories 78
4.3.8. Potentiometers 79
4.3.9. Quartz oscillators 81
4.3.10. Voltage references 81
4.4. Summary of components with limited service life 82
Chapter 5. Analysis of Product Performances 85
5.1. Analyses during the design stage 85
5.1.1. Worst-case analysis 85
5.1.2. Quadratic analysis 88
5.1.3. Monte-Carlo analysis 89
5.1.4. Numerical simulations 91
5.2. Analyses during the manufacturing stage 92
Chapter 6. Aggravated Tests 95
6.1. Definition 95
6.2. Objectives of aggravated tests 95
6.3. Principles of aggravated tests 97
6.3.1. Choice of physical constraints 101
6.3.2. Principle of HALT 101
6.3.3. Specific or additional constraints 106
6.3.4. Number of required samples 106
6.3.5. Operational test, diagnosis and identification of weaknesses 107
6.3.6. Monitoring specification 107
6.3.7. Instrumentation 108
6.3.8. Root cause analysis, corrective actions and breakdown management 108
