Rajkumar Durairaj

Rheology and processing of pastes for electronic packaging materials

Novel rheological characterisation techniques for lead-free solder pastes and electrical conductive adhesives

• Broschiertes Buch

Produktbeschreibung

The stencil printing of pastes (solder paste and
electrical conductive adhesives) is a very important
stage in the assembly of electronic packages. There
is wide agreement in industry that the paste printing
process accounts for the majority of assembly
defects, which originate from poor understanding of
the correlation between the paste rheology and the
printing process. The development of new pastes
formulations is a complex process. As a result more
extensive rheological characterisation techniques are
required to understand the flow behaviour of the
pastes under different shear conditions. This book
focuses on the rheological characterisation of pastes
and their correlation to the stencil printing
process. A general guideline has been developed from
the extensive set of results from this research, in
particular, on the aspect of correlating key paste
performance indicators to the rheological test
methods. The book is aimed at paste and electronic
manufacturers with an interest of incorporating
rheology as a research and quality assurance tool in
their formulation and production processes.

Produktdetails

• Verlag: VDM Verlag Dr. Müller
• Seitenzahl: 120
• Englisch
• Abmessung: 7mm x 150mm x 220mm
• Gewicht: 177g
• ISBN-13: 9783639157468
• ISBN-10: 363915746X
• Artikelnr.: 26484571

Autorenporträt

Dr.Rajkumar Durairaj is Assistant Professor of Mechanical
Engineering at the Universiti Tunku Abdul Rahman
(UTAR),Malaysia. His research interest is in rheological studies
of nano-electronic materials. He is a Member
of the Institution of Mechanical Engineers(UK) and a registered
Chartered Engineer with the Engineering Council(UK).