This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects. Currently, light waves are ready to come into boxes of computers in high-performance computing systems.
This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects. Currently, light waves are ready to come into boxes of computers in high-performance computing systems.Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
Tetsuzo Yoshimura is currently a professor emeritus at Tokyo University of Technology.
Inhaltsangabe
1. Introduction 2. Guidelines toward Self Organized 3D Integrated Optical Interconnects 3. Scalable Film Optical Link Modules (S FOLMs) 4. Optical Waveguide Films with Vertical Mirrors and 3D Optical Circuits 5. Resource Saving All Photolithographic Heterogeneous Integration: PL Pack with SORT 6. High Speed/Small Size Light Modulators and Optical Switches 7. Self Organized Lightwave Networks (SOLNETs) 8. Self Organized 3D Integrated Optical Interconnects: Model Proposals 9. Self Organized 3D Micro Optical Switching Systems (3D MOSS): Model Proposals and Predicted Performance 10. Film Based Integrated Solar Energy Conversion Systems 11. Embodiments Disclosed in Patents 12. Future Challenges
1. Introduction 2. Guidelines toward Self Organized 3D Integrated Optical Interconnects 3. Scalable Film Optical Link Modules (S FOLMs) 4. Optical Waveguide Films with Vertical Mirrors and 3D Optical Circuits 5. Resource Saving All Photolithographic Heterogeneous Integration: PL Pack with SORT 6. High Speed/Small Size Light Modulators and Optical Switches 7. Self Organized Lightwave Networks (SOLNETs) 8. Self Organized 3D Integrated Optical Interconnects: Model Proposals 9. Self Organized 3D Micro Optical Switching Systems (3D MOSS): Model Proposals and Predicted Performance 10. Film Based Integrated Solar Energy Conversion Systems 11. Embodiments Disclosed in Patents 12. Future Challenges
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