The book focuses on radiation, operating conditions, sensor systems, and package and system design.Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
Section I Radiation. Commercial Off-the-Shelf Components in Space Applications. Soft Errors in Digital Circuits Subjected to Natural Radiation: Characterisation, Modelling and Simulation Issues. Simulation of Single-Event Effects on Fully Depleted Siliconon-Insulator (FDSOI) CMOS. Section II Sensors and Operating Conditions. Electronic Sensors for the Detection of Ovarian Cancer. Sensors and Sensor Systems for Harsh Environment Applications. III-Nitride Electronic Devices for Harsh Environments. Section III Packaging and System Design. Packaging for Systems in Harsh Environments. Corrosion Resistance of Lead-Free Solders under Environmental Stress. From Deep Submicron Degradation Effects to Harsh Operating Environments: A Self-Healing Calibration Methodology for Performance and Reliability Enhancement. Role of Diffusional Interfacial Sliding during Temperature Cycling and Electromigration-Induced Motion of Copper Through Silicon Via.
Section I Radiation. Commercial Off-the-Shelf Components in Space Applications. Soft Errors in Digital Circuits Subjected to Natural Radiation: Characterisation, Modelling and Simulation Issues. Simulation of Single-Event Effects on Fully Depleted Siliconon-Insulator (FDSOI) CMOS. Section II Sensors and Operating Conditions. Electronic Sensors for the Detection of Ovarian Cancer. Sensors and Sensor Systems for Harsh Environment Applications. III-Nitride Electronic Devices for Harsh Environments. Section III Packaging and System Design. Packaging for Systems in Harsh Environments. Corrosion Resistance of Lead-Free Solders under Environmental Stress. From Deep Submicron Degradation Effects to Harsh Operating Environments: A Self-Healing Calibration Methodology for Performance and Reliability Enhancement. Role of Diffusional Interfacial Sliding during Temperature Cycling and Electromigration-Induced Motion of Copper Through Silicon Via.
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