Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny

Silicon Microchannel Heat Sinks

Theories and Phenomena

• Gebundenes Buch

Produktbeschreibung

Two-phase microchannel cooling is one of the most promising thermal-management technologies for future high-power IC chips. Understanding the boiling process and the two-phase-flow behavior in microchannels is the key to successful implementation of a microchannel heat sink. This book focuses on the phase-change phenomena and the heat transfer in sub-150 nm diameter silicon microchannels, with emphasis on thermal measurement and modeling, and the impact of small dimensions on two-phase flow regimes.

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There is significant current interest in new technologies for IC (Integrated Circuit) cooling, driven by the rapid increase in power densities in ICs and the trend towards high-density electronic packaging for applications throughout civilian and military markets. In accordance with Moore's Law, the number of transistors on 6 Intel Pentium microprocessors has increased from 7.5 x10 in 1997 (Pentium II) to 6 55 x10 in 2002 (Pentium 4). Considering the rapid increase in the integration density, thermal management must be well designed to ensure proper functionality of these high-speed, high-power chips. Forced air convection has been traditionally used to remove the heat through a finned heat sink and fan module. 2 Currently, with 82 W power dissipation rate, approximately 62 W/cm heat flux, from a Pentium 4 processor with 3.06 GHz core frequency, the noise generated from high rotating speed fans is approaching the limit of acceptable level for humans. However, the power dissipation from a single cost-performance chip is 2 expected to exceed 100 W/cm by the year 2005, when the air cooling has to be replaced by new cooling technologies. Among alternative cooling methods, the two-phase microchannel heat sink is one of the most promising solutions. Understanding the boiling process and the two-phase flow behavior in microchannels is the key to successful implementation of such a device.

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Produktdetails

• Microtechnology and MEMS
• Verlag: Springer / Springer Berlin Heidelberg / Springer, Berlin
• Artikelnr. des Verlages: 978-3-540-40181-0
• 2004
• Seitenzahl: 156
• Erscheinungstermin: 26. November 2003
• Englisch
• Abmessung: 241mm x 160mm x 15mm
• Gewicht: 354g
• ISBN-13: 9783540401810
• ISBN-10: 3540401814
• Artikelnr.: 12233635

Autorenporträt

Lian Zhang, Molecular Nanosystems, Palo Alto, CA, USA / Kenneth E. Goodson, Stanford University, Stanford, CA, USA / Thomas W. Kenny, Stanford University, Stanford, CA, USA

Inhaltsangabe

1 Introduction.- 2 Two-phase Microchannel Heat Sinks: Problems and Challenges.- 3 A Thermal Experimental System with Freestanding Microchannels.- 4 Measurements and Modeling of Two-phase Flow in Microchannels.- 5 Boiling Regimes and Transient Signals Associated with the Phase Change.- 6 Enhanced Nucleate Boiling in Microchannels.- 7 Conclusions.- Appendix A: Process Flow Chart for Single-channel Devices with Combined Heater and Thermometers.- Appendix B: Process Flow Chart for Single-channel Devices with Separate Heater and Thermometers.- References.