Solution Processing of Inorganic Materials
Ed. by David Mitzi
Solution Processing of Inorganic Materials
Ed. by David Mitzi
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The search for electronic materials that can be solution-processed into thin-film form at low temperature while simultaneously providing quality device characteristics represents a substantial challenge for materials chemists. Continuous semiconducting thin films with field-effect mobilities of 10 cm²/V-sec are particularly desirable for high-speed microelectronic applications. Other device components (dielectrics, contacts, buffer layers, etc.) must also be able to be deposited from solution to provide for ultimate low-cost device fabrication. Attainment of the above goals would provide…mehr
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The search for electronic materials that can be solution-processed into thin-film form at low temperature while simultaneously providing quality device characteristics represents a substantial challenge for materials chemists. Continuous semiconducting thin films with field-effect mobilities of 10 cm²/V-sec are particularly desirable for high-speed microelectronic applications. Other device components (dielectrics, contacts, buffer layers, etc.) must also be able to be deposited from solution to provide for ultimate low-cost device fabrication. Attainment of the above goals would provide important new opportunities for electronic devices, including potentially low-cost, large-area and flexible computing devices, displays, sensors and solar cells. While the majority of work toward this goal has focused on organic films (both molecular and polymeric), this book will review recent developments in the search for solution-processible inorganic semiconductors (as well as other critical electronic components), offering the potential for much higher performance and better thermal/mechanical stability than comparable organic-based systems. In particular, the book will focus on materials and techniques that are compatible with high-throughput, low-cost and low-temperature deposition processes, such as spin coating, dip coating, printing or stamping, since these offer the highest probablility of revolutionizing the electronics industry. Throughout the text, emphasis will be placed on providing concrete examples of applications that employ the described solution-processed films (transistors, solar cells, sensors, etc.).
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Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
Produktdetails
- Produktdetails
- Verlag: Wiley & Sons
- 1. Auflage
- Seitenzahl: 520
- Erscheinungstermin: 1. Dezember 2008
- Englisch
- Abmessung: 239mm x 160mm x 28mm
- Gewicht: 804g
- ISBN-13: 9780470406656
- ISBN-10: 0470406658
- Artikelnr.: 25529455
- Verlag: Wiley & Sons
- 1. Auflage
- Seitenzahl: 520
- Erscheinungstermin: 1. Dezember 2008
- Englisch
- Abmessung: 239mm x 160mm x 28mm
- Gewicht: 804g
- ISBN-13: 9780470406656
- ISBN-10: 0470406658
- Artikelnr.: 25529455
David B. Mitzi, PhD, is a Research Staff Member in the Physical Sciences Department at the IBM Thomas J. Watson Research Center. His research examines the solid-state chemistry, thin-film deposition and device opportunities for a variety of materials with potentially useful electronic or optical properties. Most recently, his focus has been on organic-inorganic hybrids and the development of solution-processed high-mobility inorganic semiconductors for thin-film devices (e.g., TFTs, LEDs, solar cells). Dr. Mitzi holds a number of patents and has authored or coauthored more than one hundred papers.
Preface. Contributors. 1. Introduction to Solution-Deposited Inorganic
Electronics (Robert H. Reuss and Babu R. Chalamala). 1.1 Background and
Motivation. 1.2 Importance of Solution Processing. 1.3 Application
Challenges: TFT Devices and Circuits. 1.4 Application Challenges:
Optoelectronics. 1.5 Application Challenges: Power Sources, Sensors, and
Actuators. 1.6 Conclusions. References. 2. Chemical Solution
Deposition--Basic Principles (Robert W. Schwartz and Manoj Narayanan). 2.1
Introduction. 2.2 Substrate Surface Preparation. 2.3 Starting Reagents and
Solvents. 2.4 Precursor Solution Preparation and Characteristics. 2.5 Film
Formation Behavior. 2.6 Structural Evolution: Film Formation, Densifi
cation, and Crystallization. 2.7 Summary. References. 3. Solution
Processing of Chalcogenide Semiconductors via Dimensional Reduction (David
B. Mitzi). 3.1 Introduction. 3.2 Dimensional Reduction. 3.3 Hydrazine
Precursor Route. 3.4 Similar Approaches without Hydrazine. 3.5 Future
Prospects. References. 4. Oxide Dielectric Films for Active Electronics
(Douglas A. Keszler, Jeremy T. Anderson, and Stephen T. Meyers). 4.1
Introduction. 4.2 Gate Dielectric Materials Selection. 4.3 Producing
High-Quality Films from Solution. 4.4 HafSOx Thin-Film Dielectrics. 4.5
AlPO Thin-Film Dielectric. 4.6 Compositionally Graded and Laminated
Structures. 4.7 Summary and Perspective. References. 5. Liquid Silicon
Materials (Masahiro Furusawa and Hideki Tanaka). 5.1 Introduction. 5.2
Liquid Silicon Material. 5.3 Forming Silicon Films from the Liquid Silicon
Materials. 5.4 Fabrication of a TFT Using a Solution-Processed Silicon
Film. 5.5 Fabrication of TFT Using Inkjet-Printed Silicon Film. 5.6 Forming
SiO2 Films from the Liquid Silicon Materials. 5.7 LTPS Fabrication Using
Solution-Processed SiO2 Films. 5.8 Forming Doped Silicon Films. 5.9
Conclusions. Acknowledgments. References. 6. Spray CVD of Single-Source
Precursors for Chalcopyrite I-III-VI2 Thin-Film Materials (Aloysius F.
Hepp, Kulbinder K. Banger, Michael H.-C. Jin, Jerry D. Harris, Jeremiah S.
McNatt, and John E. Dickman). 6.1 Introduction. 6.2 Single-Source Precursor
Studies. 6.3 Spray or Atmosphere-Assisted CVD Processing. 6.4 Atmospheric
Pressure Hot-Wall Reactor Parametric Study. 6.5 Fabrication and Testing of
CIS Solar Cells. 6.6 Concluding Remarks. Acknowledgments. References. 7.
Chemical Bath Deposition, Electrodeposition, and Electroless Deposition of
Semiconductors, Superconductors, and Oxide Materials (Raghu Bhattacharya).
7.1 Introduction. 7.2 Chemical Bath Deposition. 7.3 Deposition of CIGS by
Electrodeposition and Electroless Deposition. 7.4 Electrodeposition of
Oxide Superconductors. 7.5 Electrodeposition of Cerium Oxide Films. 7.6
Electrodeposition of Gd2Zr2O7. References. 8. Successive Ionic Layer
Adsorption and Reaction (SILAR) and Related Sequential Solution-Phase
Deposition Techniques (Seppo Lindroos and Markku Leskelä). 8.1
Introduction. 8.2 SILAR. 8.3 Materials Grown by SILAR. 8.4 ILGAR. 8.5
ECALE. 8.6 Other Sequential Solution-Phase Deposition Techniques.
References. 9. Evaporation-Induced Self-Assembly for the Preparation of
Porous Metal Oxide Films (Bernd Smarsly and Dina Fattakhova-Rohlfing). 9.1
Introduction. 9.2 The EISA Process. 9.3 Characterization of Self-Assembled
Films. 9.4 Generation of Mesoporous Crystalline Metal Oxide Films Via
Evaporation-Induced Self-Assembly. 9.5 Electronic Applications. 9.6
Mesoporous Films in Dye-Sensitized Solar Cells. 9.7 Conclusions.
References. 10. Engineered Nanomaterials as Soluble Precursors for
Inorganic Films (Dmitri V. Talapin). 10.1 Introduction. 10.2 Synthesis of
Inorganic Nanomaterials. 10.3 Nanoparticles as Soluble Building Blocks for
Inorganic Films. 10.4 Films and Arrays of Inorganic Nanowires. 10.5
Applications Using Networks and Arrays of Carbon Nanotubes. 10.6 Concluding
Remarks. Acknowledgments. References. 11. Functional Structures Assembled
from Nanoscale Building Blocks (Yu Huang). 11.1 Introduction. 11.2 Building
Blocks: Synthesis and Properties. 11.3 Hierarchical Assembly of Nanowires.
11.4 Nanowire Electronics and Optoelectronics. 11.5 Nanowire Thin-Film
Electronics--Concept and Performance. 11.6 Summary and Perspective.
References. 12. Patterning Techniques for Solution Deposition (Paul Brazis,
Daniel Gamota, Jie Zhang, and John Szczech). 12.1 Introduction. 12.2
Opportunities for Printable Inorganic verses Organic Materials Systems.
12.3 Printing and the Microelectronics Industry--Present and Future. 12.4
Printed Electronics Value Chain. 12.5 Electrically Functional Inks. 12.6
Printing Technologies. 12.7 Structure of a Printed Transistor. 12.8
Patterning Techniques for Solution Deposition: Technology Diffusion. 12.9
Conclusions. References. 13. Transfer Printing Techniques and Inorganic
Single-Crystalline Materials for Flexible and Stretchable Electronics
(Jong-Hyun Ahn, Matthew A. Meitl, Aflred J. Baca, Dahl-Young Khang,
Hoon-Sik Kim, and John A. Rogers). 13.1 Introduction. 13.2 Inorganic
Single-Crystalline Semiconductor Materials for Flexible Electronics. 13.3
Transfer Printing Using an Elastomer Stamp. 13.4 Flexible Thin-Film
Transistors that Use 1/4s-Sc on Plastic. 13.5 Integrated Circuits on
Plastic. 13.6 1/4s-Sc Electronics on Rubber. 13.7 Conclusion. References.
14. Future Directions for Solution-Based Processing of Inorganic Materials
(M. F. A. M. van Hest and D. S. Ginley). 14.1 Introduction. 14.2 Materials.
14.3 Deposition Approaches. 14.4 Next Generation of Applications. 14.5
Conclusions. References. Index.
Electronics (Robert H. Reuss and Babu R. Chalamala). 1.1 Background and
Motivation. 1.2 Importance of Solution Processing. 1.3 Application
Challenges: TFT Devices and Circuits. 1.4 Application Challenges:
Optoelectronics. 1.5 Application Challenges: Power Sources, Sensors, and
Actuators. 1.6 Conclusions. References. 2. Chemical Solution
Deposition--Basic Principles (Robert W. Schwartz and Manoj Narayanan). 2.1
Introduction. 2.2 Substrate Surface Preparation. 2.3 Starting Reagents and
Solvents. 2.4 Precursor Solution Preparation and Characteristics. 2.5 Film
Formation Behavior. 2.6 Structural Evolution: Film Formation, Densifi
cation, and Crystallization. 2.7 Summary. References. 3. Solution
Processing of Chalcogenide Semiconductors via Dimensional Reduction (David
B. Mitzi). 3.1 Introduction. 3.2 Dimensional Reduction. 3.3 Hydrazine
Precursor Route. 3.4 Similar Approaches without Hydrazine. 3.5 Future
Prospects. References. 4. Oxide Dielectric Films for Active Electronics
(Douglas A. Keszler, Jeremy T. Anderson, and Stephen T. Meyers). 4.1
Introduction. 4.2 Gate Dielectric Materials Selection. 4.3 Producing
High-Quality Films from Solution. 4.4 HafSOx Thin-Film Dielectrics. 4.5
AlPO Thin-Film Dielectric. 4.6 Compositionally Graded and Laminated
Structures. 4.7 Summary and Perspective. References. 5. Liquid Silicon
Materials (Masahiro Furusawa and Hideki Tanaka). 5.1 Introduction. 5.2
Liquid Silicon Material. 5.3 Forming Silicon Films from the Liquid Silicon
Materials. 5.4 Fabrication of a TFT Using a Solution-Processed Silicon
Film. 5.5 Fabrication of TFT Using Inkjet-Printed Silicon Film. 5.6 Forming
SiO2 Films from the Liquid Silicon Materials. 5.7 LTPS Fabrication Using
Solution-Processed SiO2 Films. 5.8 Forming Doped Silicon Films. 5.9
Conclusions. Acknowledgments. References. 6. Spray CVD of Single-Source
Precursors for Chalcopyrite I-III-VI2 Thin-Film Materials (Aloysius F.
Hepp, Kulbinder K. Banger, Michael H.-C. Jin, Jerry D. Harris, Jeremiah S.
McNatt, and John E. Dickman). 6.1 Introduction. 6.2 Single-Source Precursor
Studies. 6.3 Spray or Atmosphere-Assisted CVD Processing. 6.4 Atmospheric
Pressure Hot-Wall Reactor Parametric Study. 6.5 Fabrication and Testing of
CIS Solar Cells. 6.6 Concluding Remarks. Acknowledgments. References. 7.
Chemical Bath Deposition, Electrodeposition, and Electroless Deposition of
Semiconductors, Superconductors, and Oxide Materials (Raghu Bhattacharya).
7.1 Introduction. 7.2 Chemical Bath Deposition. 7.3 Deposition of CIGS by
Electrodeposition and Electroless Deposition. 7.4 Electrodeposition of
Oxide Superconductors. 7.5 Electrodeposition of Cerium Oxide Films. 7.6
Electrodeposition of Gd2Zr2O7. References. 8. Successive Ionic Layer
Adsorption and Reaction (SILAR) and Related Sequential Solution-Phase
Deposition Techniques (Seppo Lindroos and Markku Leskelä). 8.1
Introduction. 8.2 SILAR. 8.3 Materials Grown by SILAR. 8.4 ILGAR. 8.5
ECALE. 8.6 Other Sequential Solution-Phase Deposition Techniques.
References. 9. Evaporation-Induced Self-Assembly for the Preparation of
Porous Metal Oxide Films (Bernd Smarsly and Dina Fattakhova-Rohlfing). 9.1
Introduction. 9.2 The EISA Process. 9.3 Characterization of Self-Assembled
Films. 9.4 Generation of Mesoporous Crystalline Metal Oxide Films Via
Evaporation-Induced Self-Assembly. 9.5 Electronic Applications. 9.6
Mesoporous Films in Dye-Sensitized Solar Cells. 9.7 Conclusions.
References. 10. Engineered Nanomaterials as Soluble Precursors for
Inorganic Films (Dmitri V. Talapin). 10.1 Introduction. 10.2 Synthesis of
Inorganic Nanomaterials. 10.3 Nanoparticles as Soluble Building Blocks for
Inorganic Films. 10.4 Films and Arrays of Inorganic Nanowires. 10.5
Applications Using Networks and Arrays of Carbon Nanotubes. 10.6 Concluding
Remarks. Acknowledgments. References. 11. Functional Structures Assembled
from Nanoscale Building Blocks (Yu Huang). 11.1 Introduction. 11.2 Building
Blocks: Synthesis and Properties. 11.3 Hierarchical Assembly of Nanowires.
11.4 Nanowire Electronics and Optoelectronics. 11.5 Nanowire Thin-Film
Electronics--Concept and Performance. 11.6 Summary and Perspective.
References. 12. Patterning Techniques for Solution Deposition (Paul Brazis,
Daniel Gamota, Jie Zhang, and John Szczech). 12.1 Introduction. 12.2
Opportunities for Printable Inorganic verses Organic Materials Systems.
12.3 Printing and the Microelectronics Industry--Present and Future. 12.4
Printed Electronics Value Chain. 12.5 Electrically Functional Inks. 12.6
Printing Technologies. 12.7 Structure of a Printed Transistor. 12.8
Patterning Techniques for Solution Deposition: Technology Diffusion. 12.9
Conclusions. References. 13. Transfer Printing Techniques and Inorganic
Single-Crystalline Materials for Flexible and Stretchable Electronics
(Jong-Hyun Ahn, Matthew A. Meitl, Aflred J. Baca, Dahl-Young Khang,
Hoon-Sik Kim, and John A. Rogers). 13.1 Introduction. 13.2 Inorganic
Single-Crystalline Semiconductor Materials for Flexible Electronics. 13.3
Transfer Printing Using an Elastomer Stamp. 13.4 Flexible Thin-Film
Transistors that Use 1/4s-Sc on Plastic. 13.5 Integrated Circuits on
Plastic. 13.6 1/4s-Sc Electronics on Rubber. 13.7 Conclusion. References.
14. Future Directions for Solution-Based Processing of Inorganic Materials
(M. F. A. M. van Hest and D. S. Ginley). 14.1 Introduction. 14.2 Materials.
14.3 Deposition Approaches. 14.4 Next Generation of Applications. 14.5
Conclusions. References. Index.
Preface. Contributors. 1. Introduction to Solution-Deposited Inorganic
Electronics (Robert H. Reuss and Babu R. Chalamala). 1.1 Background and
Motivation. 1.2 Importance of Solution Processing. 1.3 Application
Challenges: TFT Devices and Circuits. 1.4 Application Challenges:
Optoelectronics. 1.5 Application Challenges: Power Sources, Sensors, and
Actuators. 1.6 Conclusions. References. 2. Chemical Solution
Deposition--Basic Principles (Robert W. Schwartz and Manoj Narayanan). 2.1
Introduction. 2.2 Substrate Surface Preparation. 2.3 Starting Reagents and
Solvents. 2.4 Precursor Solution Preparation and Characteristics. 2.5 Film
Formation Behavior. 2.6 Structural Evolution: Film Formation, Densifi
cation, and Crystallization. 2.7 Summary. References. 3. Solution
Processing of Chalcogenide Semiconductors via Dimensional Reduction (David
B. Mitzi). 3.1 Introduction. 3.2 Dimensional Reduction. 3.3 Hydrazine
Precursor Route. 3.4 Similar Approaches without Hydrazine. 3.5 Future
Prospects. References. 4. Oxide Dielectric Films for Active Electronics
(Douglas A. Keszler, Jeremy T. Anderson, and Stephen T. Meyers). 4.1
Introduction. 4.2 Gate Dielectric Materials Selection. 4.3 Producing
High-Quality Films from Solution. 4.4 HafSOx Thin-Film Dielectrics. 4.5
AlPO Thin-Film Dielectric. 4.6 Compositionally Graded and Laminated
Structures. 4.7 Summary and Perspective. References. 5. Liquid Silicon
Materials (Masahiro Furusawa and Hideki Tanaka). 5.1 Introduction. 5.2
Liquid Silicon Material. 5.3 Forming Silicon Films from the Liquid Silicon
Materials. 5.4 Fabrication of a TFT Using a Solution-Processed Silicon
Film. 5.5 Fabrication of TFT Using Inkjet-Printed Silicon Film. 5.6 Forming
SiO2 Films from the Liquid Silicon Materials. 5.7 LTPS Fabrication Using
Solution-Processed SiO2 Films. 5.8 Forming Doped Silicon Films. 5.9
Conclusions. Acknowledgments. References. 6. Spray CVD of Single-Source
Precursors for Chalcopyrite I-III-VI2 Thin-Film Materials (Aloysius F.
Hepp, Kulbinder K. Banger, Michael H.-C. Jin, Jerry D. Harris, Jeremiah S.
McNatt, and John E. Dickman). 6.1 Introduction. 6.2 Single-Source Precursor
Studies. 6.3 Spray or Atmosphere-Assisted CVD Processing. 6.4 Atmospheric
Pressure Hot-Wall Reactor Parametric Study. 6.5 Fabrication and Testing of
CIS Solar Cells. 6.6 Concluding Remarks. Acknowledgments. References. 7.
Chemical Bath Deposition, Electrodeposition, and Electroless Deposition of
Semiconductors, Superconductors, and Oxide Materials (Raghu Bhattacharya).
7.1 Introduction. 7.2 Chemical Bath Deposition. 7.3 Deposition of CIGS by
Electrodeposition and Electroless Deposition. 7.4 Electrodeposition of
Oxide Superconductors. 7.5 Electrodeposition of Cerium Oxide Films. 7.6
Electrodeposition of Gd2Zr2O7. References. 8. Successive Ionic Layer
Adsorption and Reaction (SILAR) and Related Sequential Solution-Phase
Deposition Techniques (Seppo Lindroos and Markku Leskelä). 8.1
Introduction. 8.2 SILAR. 8.3 Materials Grown by SILAR. 8.4 ILGAR. 8.5
ECALE. 8.6 Other Sequential Solution-Phase Deposition Techniques.
References. 9. Evaporation-Induced Self-Assembly for the Preparation of
Porous Metal Oxide Films (Bernd Smarsly and Dina Fattakhova-Rohlfing). 9.1
Introduction. 9.2 The EISA Process. 9.3 Characterization of Self-Assembled
Films. 9.4 Generation of Mesoporous Crystalline Metal Oxide Films Via
Evaporation-Induced Self-Assembly. 9.5 Electronic Applications. 9.6
Mesoporous Films in Dye-Sensitized Solar Cells. 9.7 Conclusions.
References. 10. Engineered Nanomaterials as Soluble Precursors for
Inorganic Films (Dmitri V. Talapin). 10.1 Introduction. 10.2 Synthesis of
Inorganic Nanomaterials. 10.3 Nanoparticles as Soluble Building Blocks for
Inorganic Films. 10.4 Films and Arrays of Inorganic Nanowires. 10.5
Applications Using Networks and Arrays of Carbon Nanotubes. 10.6 Concluding
Remarks. Acknowledgments. References. 11. Functional Structures Assembled
from Nanoscale Building Blocks (Yu Huang). 11.1 Introduction. 11.2 Building
Blocks: Synthesis and Properties. 11.3 Hierarchical Assembly of Nanowires.
11.4 Nanowire Electronics and Optoelectronics. 11.5 Nanowire Thin-Film
Electronics--Concept and Performance. 11.6 Summary and Perspective.
References. 12. Patterning Techniques for Solution Deposition (Paul Brazis,
Daniel Gamota, Jie Zhang, and John Szczech). 12.1 Introduction. 12.2
Opportunities for Printable Inorganic verses Organic Materials Systems.
12.3 Printing and the Microelectronics Industry--Present and Future. 12.4
Printed Electronics Value Chain. 12.5 Electrically Functional Inks. 12.6
Printing Technologies. 12.7 Structure of a Printed Transistor. 12.8
Patterning Techniques for Solution Deposition: Technology Diffusion. 12.9
Conclusions. References. 13. Transfer Printing Techniques and Inorganic
Single-Crystalline Materials for Flexible and Stretchable Electronics
(Jong-Hyun Ahn, Matthew A. Meitl, Aflred J. Baca, Dahl-Young Khang,
Hoon-Sik Kim, and John A. Rogers). 13.1 Introduction. 13.2 Inorganic
Single-Crystalline Semiconductor Materials for Flexible Electronics. 13.3
Transfer Printing Using an Elastomer Stamp. 13.4 Flexible Thin-Film
Transistors that Use 1/4s-Sc on Plastic. 13.5 Integrated Circuits on
Plastic. 13.6 1/4s-Sc Electronics on Rubber. 13.7 Conclusion. References.
14. Future Directions for Solution-Based Processing of Inorganic Materials
(M. F. A. M. van Hest and D. S. Ginley). 14.1 Introduction. 14.2 Materials.
14.3 Deposition Approaches. 14.4 Next Generation of Applications. 14.5
Conclusions. References. Index.
Electronics (Robert H. Reuss and Babu R. Chalamala). 1.1 Background and
Motivation. 1.2 Importance of Solution Processing. 1.3 Application
Challenges: TFT Devices and Circuits. 1.4 Application Challenges:
Optoelectronics. 1.5 Application Challenges: Power Sources, Sensors, and
Actuators. 1.6 Conclusions. References. 2. Chemical Solution
Deposition--Basic Principles (Robert W. Schwartz and Manoj Narayanan). 2.1
Introduction. 2.2 Substrate Surface Preparation. 2.3 Starting Reagents and
Solvents. 2.4 Precursor Solution Preparation and Characteristics. 2.5 Film
Formation Behavior. 2.6 Structural Evolution: Film Formation, Densifi
cation, and Crystallization. 2.7 Summary. References. 3. Solution
Processing of Chalcogenide Semiconductors via Dimensional Reduction (David
B. Mitzi). 3.1 Introduction. 3.2 Dimensional Reduction. 3.3 Hydrazine
Precursor Route. 3.4 Similar Approaches without Hydrazine. 3.5 Future
Prospects. References. 4. Oxide Dielectric Films for Active Electronics
(Douglas A. Keszler, Jeremy T. Anderson, and Stephen T. Meyers). 4.1
Introduction. 4.2 Gate Dielectric Materials Selection. 4.3 Producing
High-Quality Films from Solution. 4.4 HafSOx Thin-Film Dielectrics. 4.5
AlPO Thin-Film Dielectric. 4.6 Compositionally Graded and Laminated
Structures. 4.7 Summary and Perspective. References. 5. Liquid Silicon
Materials (Masahiro Furusawa and Hideki Tanaka). 5.1 Introduction. 5.2
Liquid Silicon Material. 5.3 Forming Silicon Films from the Liquid Silicon
Materials. 5.4 Fabrication of a TFT Using a Solution-Processed Silicon
Film. 5.5 Fabrication of TFT Using Inkjet-Printed Silicon Film. 5.6 Forming
SiO2 Films from the Liquid Silicon Materials. 5.7 LTPS Fabrication Using
Solution-Processed SiO2 Films. 5.8 Forming Doped Silicon Films. 5.9
Conclusions. Acknowledgments. References. 6. Spray CVD of Single-Source
Precursors for Chalcopyrite I-III-VI2 Thin-Film Materials (Aloysius F.
Hepp, Kulbinder K. Banger, Michael H.-C. Jin, Jerry D. Harris, Jeremiah S.
McNatt, and John E. Dickman). 6.1 Introduction. 6.2 Single-Source Precursor
Studies. 6.3 Spray or Atmosphere-Assisted CVD Processing. 6.4 Atmospheric
Pressure Hot-Wall Reactor Parametric Study. 6.5 Fabrication and Testing of
CIS Solar Cells. 6.6 Concluding Remarks. Acknowledgments. References. 7.
Chemical Bath Deposition, Electrodeposition, and Electroless Deposition of
Semiconductors, Superconductors, and Oxide Materials (Raghu Bhattacharya).
7.1 Introduction. 7.2 Chemical Bath Deposition. 7.3 Deposition of CIGS by
Electrodeposition and Electroless Deposition. 7.4 Electrodeposition of
Oxide Superconductors. 7.5 Electrodeposition of Cerium Oxide Films. 7.6
Electrodeposition of Gd2Zr2O7. References. 8. Successive Ionic Layer
Adsorption and Reaction (SILAR) and Related Sequential Solution-Phase
Deposition Techniques (Seppo Lindroos and Markku Leskelä). 8.1
Introduction. 8.2 SILAR. 8.3 Materials Grown by SILAR. 8.4 ILGAR. 8.5
ECALE. 8.6 Other Sequential Solution-Phase Deposition Techniques.
References. 9. Evaporation-Induced Self-Assembly for the Preparation of
Porous Metal Oxide Films (Bernd Smarsly and Dina Fattakhova-Rohlfing). 9.1
Introduction. 9.2 The EISA Process. 9.3 Characterization of Self-Assembled
Films. 9.4 Generation of Mesoporous Crystalline Metal Oxide Films Via
Evaporation-Induced Self-Assembly. 9.5 Electronic Applications. 9.6
Mesoporous Films in Dye-Sensitized Solar Cells. 9.7 Conclusions.
References. 10. Engineered Nanomaterials as Soluble Precursors for
Inorganic Films (Dmitri V. Talapin). 10.1 Introduction. 10.2 Synthesis of
Inorganic Nanomaterials. 10.3 Nanoparticles as Soluble Building Blocks for
Inorganic Films. 10.4 Films and Arrays of Inorganic Nanowires. 10.5
Applications Using Networks and Arrays of Carbon Nanotubes. 10.6 Concluding
Remarks. Acknowledgments. References. 11. Functional Structures Assembled
from Nanoscale Building Blocks (Yu Huang). 11.1 Introduction. 11.2 Building
Blocks: Synthesis and Properties. 11.3 Hierarchical Assembly of Nanowires.
11.4 Nanowire Electronics and Optoelectronics. 11.5 Nanowire Thin-Film
Electronics--Concept and Performance. 11.6 Summary and Perspective.
References. 12. Patterning Techniques for Solution Deposition (Paul Brazis,
Daniel Gamota, Jie Zhang, and John Szczech). 12.1 Introduction. 12.2
Opportunities for Printable Inorganic verses Organic Materials Systems.
12.3 Printing and the Microelectronics Industry--Present and Future. 12.4
Printed Electronics Value Chain. 12.5 Electrically Functional Inks. 12.6
Printing Technologies. 12.7 Structure of a Printed Transistor. 12.8
Patterning Techniques for Solution Deposition: Technology Diffusion. 12.9
Conclusions. References. 13. Transfer Printing Techniques and Inorganic
Single-Crystalline Materials for Flexible and Stretchable Electronics
(Jong-Hyun Ahn, Matthew A. Meitl, Aflred J. Baca, Dahl-Young Khang,
Hoon-Sik Kim, and John A. Rogers). 13.1 Introduction. 13.2 Inorganic
Single-Crystalline Semiconductor Materials for Flexible Electronics. 13.3
Transfer Printing Using an Elastomer Stamp. 13.4 Flexible Thin-Film
Transistors that Use 1/4s-Sc on Plastic. 13.5 Integrated Circuits on
Plastic. 13.6 1/4s-Sc Electronics on Rubber. 13.7 Conclusion. References.
14. Future Directions for Solution-Based Processing of Inorganic Materials
(M. F. A. M. van Hest and D. S. Ginley). 14.1 Introduction. 14.2 Materials.
14.3 Deposition Approaches. 14.4 Next Generation of Applications. 14.5
Conclusions. References. Index.