Sujana N., Shashank T. N.

Study Of Thermal Interface Conductance Between Realistic Bolted Joints

• Broschiertes Buch

Produktbeschreibung

Study of heat conductance plays a major role in spacecraft thermal design under vacuum environment. Since the space environment is found to be a vacuum, the convective heat transfer is absent. Hence the conduction plays an important role in heat-transfer mechanism. The heat generated within spacecraft/satellites from an electronics box must flow through conducting medium to the box surface. This generated heat should either radiate or conduct to a heat sink. Conduction path includes number of joints in the box surface where heat must be transferred by contact between the surfaces. These joints include screws guides and bolts to attach circuit boards to an electronics-box chassis in spacecraft shelf Hence the thermal conductaithof contacting surfaces is an important parameter for spacecraft thermal design. The objective of this work is to study the temperature variations and pressure distribution on too rectangular plates (Al 6061) of different thickness (10mm and 3mm). The plates were bought together and joined using M4 bolts, with the vacuum environment by varying the cold temperature and heater positions.

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Produktdetails

• Verlag: LAP LAMBERT Academic Publishing
• Seitenzahl: 56
• Erscheinungstermin: 18. März 2021
• Englisch
• Abmessung: 220mm x 150mm x 4mm
• Gewicht: 102g
• ISBN-13: 9786203463767
• ISBN-10: 6203463760
• Artikelnr.: 62334770

Autorenporträt

Sujana N working as an assistant professor in the department of Industrial and Production Engineering at PES College of Engineering, Mandya. Completed his Master degree from Siddaganga Institute of Technology,Tumkuru in Thermal Power Engineering and carried out his final year Master Project at Indian Space and Research Organization Bangalore