Suppression of Radiated Emission in High Speed Printed Circuit Board
Using Defected Ground Structure
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The recent advances in wireless communication and semiconductor technology led to the miniaturization of circuits, increased bandwidth, and faster speed. In order to satisfy the enormous demand of low cost and smaller feature size, chips and transmission lines must be integrated within a constrained space in a printed circuit board which leads to signal integrity issues. Signal integrity is the measure of the quality of the electrical signal. The signal that travels in one interconnect will couple with the adjacent interconnects by means of electromagnetic coupling which may affect the timing ...
The recent advances in wireless communication and semiconductor technology led to the miniaturization of circuits, increased bandwidth, and faster speed. In order to satisfy the enormous demand of low cost and smaller feature size, chips and transmission lines must be integrated within a constrained space in a printed circuit board which leads to signal integrity issues. Signal integrity is the measure of the quality of the electrical signal. The signal that travels in one interconnect will couple with the adjacent interconnects by means of electromagnetic coupling which may affect the timing and the quality of the signal. The most predominant signal integrity issue is a radiated emission. The unintentional release of electromagnetic energy from interconnects is called radiated emission. The significant source of radiated emission is a common mode current. The defective ground structure (DGS) is the right candidate to suppress common mode radiation on high speed printed circuit board.
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