A new and innovative interconnection technology in opto-electronics based chip fabrication is presented. This technology gives the advantages over existing technology of electrical interconnection in terms of greater speed. After giving overview of different types of optical coupler design with planer light wave circuit, the focus of this paper is on to develop such optical coupler, gives maximum coupled optical power and reduce the back hand coupled power losses. In this book we also introduce about Silicon on Insulator and Carbon Nano Tube material based optical coupler design and its optical losses and output response. On bases of Silicon On Insulator material recently many of the component research is present in market for optical source and detector in system in package technology, so this design work as power divider and splitter. Carbon Nano Tube material based chip fabrication technology is future of recent silicon technology. Here one step ahead the Carbon Nano Tube based optical coupler design will present for new idea in system in package technology which can help in future design of optical component and other parts of optical devices.
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Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.