Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

• Broschiertes Buch

Produktbeschreibung

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

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Produktdetails

• Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems
• Verlag: Taylor & Francis Ltd
• Seitenzahl: 306
• Erscheinungstermin: 26. August 2024
• Englisch
• Abmessung: 234mm x 156mm x 17mm
• Gewicht: 460g
• ISBN-13: 9781032160856
• ISBN-10: 1032160853
• Artikelnr.: 71236296

Autorenporträt

Juan Cepeda-Rizo obtained his bachelor's degree in mechanical engineering and master's in materials engineering from Cal Poly, San Luis Obispo in 1997. After graduation he worked for a semiconductor company doing electronic packaging analysis. He received his Ph.D. from Claremont Graduate University in Applied Mathematics in and in 2008 worked for NASA's Jet Propulsion Laboratory as a thermal system engineer where his latest responsibilities included thermal and structural analysis of flight electronics. Jeremiah Gayle obtained his bachelor's degree in mechanical engineering from Arizona State University, and master's degrees from Iowa State, and John Hopkins University in space systems engineering. He is pursuing a doctorate in aerospace engineering from Colorado State University and works at NASA's Jet Propulsion Laboratory where he works on spacecraft systems and conducts thermal and structural analysis of avionics. Joshua Ravich is a supervisor for the Technology Infusion group at JPL, where he works on the mechanical design and analysis of spacecraft systems. His recent work has included the Mars Helicopter project. He received a bachelor's degree in mechanical Engineering from UC Berkeley and a master's in mechanical and aerospace engineering from the University of Michigan.

Inhaltsangabe

Introduction. New Space. Thermal/Structural Challenges in Miniaturizing.
Fundamental of Heat Transfer by Conduction and Convection. Fundamentals of
Heat Transfer by Radiation. The Multi-Layer Insulation (MLI) Blanket. Heat
Pipes. Convective Cooling of Semiconductors using a Nanofluid. Power
Systems: The Tesla Turbine. Electronics Design for Extreme Temperature and
Pressure. Characterization and Modeling of PWB Warpage and its Effect on
LGA Separable Interconnects. Resistor Networks. Thermal Analysis Case
Studies. Random Vibration Structural Analysis and Mile's Equation.
Vibrational Analysis Case Studies. Creep Prediction of a Printed Wiring
Board for Separable Land Grid Array Connector. Operational Case Studies -
Mars Surface Operations. Operational Case Studies - Dawn Asteroid Mission.
Standards.