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Testing is one of the most important phase of VLSI design cycle, which ensures quality and defect-free functionality of an integrated circuit. With the rapid advancement of design complexity, the power dissipation and thermal problems (higher temperature and thermal gradient) caused by localized heating became a serious concern. In order to perform testing of a large set of different possible fault conditions of an IC, power and temperature dissipation are increased at a much more higher rate than the normal mode of operation, resulting serious damage of the chip due to overheating and burning leading to manufacturing yield loss. This book describes several efficient external thermal-aware testing techniques for detection of the different probable faults encountered in IC while keeping the power and temperature dissipation across the chip within safe limit. This book also discusses different thermal challenges occurred during testing of three-dimensional IC compared to two-dimensional IC and efficient thermal-aware testing techniques helping in manufacturing of high quality products.