Gebundenes Buch

Thermal Management Materials for Electronic Packaging

Preparation, Characterization, and Devices

Herausgegeben: Tian, Xingyou

Beschreibung

Summarizes the development of thermal management materials and introduces the preparation methods and application scenarios of thermal management materials for electronic packing.

Autor

Professor Xingyou Tian is Deputy Director of Institute for Solid State Physics (ISSP), Hefei Institutes of Physical Science, Chinese Academy of Sciences and Director of the Key Laboratory of Photovoltaic and Energy-Saving Materials of the Chinese Academy of Sciences. His main research include key functional materials for electronic devices, integrated circuit heat dissipation materials, polymer nanocomposite materials, and new energy-saving and environmentally friendly materials.

Produktdetails

• Verlag: Wiley-VCH
• Artikelnr. des Verlages: 1135242 000
• 1. Auflage
• Seitenzahl: 368
• Erscheinungstermin: 17. Januar 2024
• Englisch
• Abmessung: 246mm x 171mm x 22mm
• Gewicht: 836g
• ISBN-13: 9783527352425
• ISBN-10: 3527352422
• Artikelnr.: 68363003