Thin Film Fluid Flow Simulation on Rotating Discs
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Prediction and analysis of complex industrial processes depend on accurate modelling of physical phenomena. One particular group of them, free-surface liquid film flows on spinning discs, forms a central piece of many industrial processes, for example a wet chemical wafer etching, a coating etc. This work presents a series of numerical studies of the film flow with an impinging jet on rotating discs which is the basis for a high performance simulation tool. Numerical studies based on the Volume-of-Fluid (VoF) method were performed and evaluated against reported experimental data. The conclusio...
Prediction and analysis of complex industrial processes depend on accurate modelling of physical phenomena. One particular group of them, free-surface liquid film flows on spinning discs, forms a central piece of many industrial processes, for example a wet chemical wafer etching, a coating etc. This work presents a series of numerical studies of the film flow with an impinging jet on rotating discs which is the basis for a high performance simulation tool. Numerical studies based on the Volume-of-Fluid (VoF) method were performed and evaluated against reported experimental data. The conclusion drawn is that a transient two-phase 3D free-surface VoF-simulation is impractical for an industrial use due to time constraints. A thin film model based on an integral method is proposed as a possible remedy. The model was implemented in the open-source software toolkit OpenFOAM using the Finite Area method. The approach is validated with the ANSYS Fluent software and its VoF-implementation. An extension of the model with a simple diffusion-controlled chemistry model for a wet chemical etching of silicon wafers is presented.
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