VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence

31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023, Revised Extended Selected Papers
Herausgegeben:Elfadel, Ibrahim (Abe) M.; Albasha, Lutfi

• Gebundenes Buch

Produktbeschreibung

This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16-18, 2023.
The 15 full papers included in this volume were carefully revised and expanded from 77 papers submitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy - and is representing cutting-edge research at the forefront of VLSI technology.

Produktdetails

• IFIP Advances in Information and Communication Technology 680
• Verlag: Springer / Springer Nature Switzerland / Springer, Berlin
• Artikelnr. des Verlages: 978-3-031-70946-3
• Seitenzahl: 332
• Erscheinungstermin: 29. Dezember 2024
• Englisch
• Abmessung: 241mm x 160mm x 24mm
• Gewicht: 608g
• ISBN-13: 9783031709463
• ISBN-10: 3031709462
• Artikelnr.: 71283119

Inhaltsangabe

Architectures.- Synthesis of SFQ Circuits with Compound Gates.- Architecture-Compiler Co-Design for ReRAM-based Multi-Core CIM Architectures.- A Leap of Confidence: A Write-Intensity aware Prudent Page Migration for Hybrid Memories.- Efficient Depth Optimization in Quantum Addition and Modular Arithmetic with Ling Structure.- Accelerators.- Exploring Constrained-Modulus Modular Multipliers for Improved Area, Power and Flexibility.- Accelerating Large Kernel Convolutions with Nested Winograd Transformation.- A Unified and Energy-Efficient Depthwise Separable Convolution Accelerator.- Resiliency and Robustness .- Analyzing the Reliability of TCUs Through Micro-architecture and Structural Evaluations for Two Real Number Formats.- Advanced Quality Assurance Platform for Robust Process Design Kits.- FPGA-Implementation Techniques to Efficiently Test Application Readiness of Mixed-Signal Products.- Radiation Tolerant 14T SRAM Cell for Avionics Applications.- 3.125GS/s, 4.9 ENOB, 109 fJ/Conversion Time-Domain ADC for Backplane Interconnect.-Security and Privacy.- Enhancing HW-SW Confidentiality Verification for Embedded Processors with SoftFlow's Advanced Memory Range Feature.- Confidential Inference in Decision Trees.- Enhancing the Security of IJTAG network using Inherently Secure SIB.