M. Alexe / U. Gösele (eds.)

Wafer Bonding

Applications and Technology
Ed. by M. Alexe and U. Gösele

• Gebundenes Buch

Produktbeschreibung

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator,photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

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Produktdetails

• Springer Series in Materials Science Vol.75
• Verlag: Springer, Berlin
• 2004
• Seitenzahl: 520
• Erscheinungstermin: 14. Mai 2004
• Englisch
• Abmessung: 241mm x 160mm x 37mm
• Gewicht: 844g
• ISBN-13: 9783540210498
• ISBN-10: 3540210490
• Artikelnr.: 12634166

Autorenporträt

M. Alexe, Max-Planck-Institut for Microstructure Physics, Halle, Germany / U. Gösele, Max-Planck-Institut for Microstructure Physics, Halle, Germany

Inhaltsangabe

- Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding
- Basics of Silicon-on-Insulator (SOI) Technology
- Silicon-on-Insulator by the Smart CutTM Process
- ELTRAN Technology Based on Wafer Bonding and Porous Silicon
- Wafer Bonding for High-Performance Logic Applications
- Application of Bonded Wafers to the Fabrication of Electronic Devices
- Compound Semiconductor Heterostructures by Smart CutTM: SiC-on-Insulator, QUASICTM Substrates, InP and GaAs Heterostructures on Silicon
- Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach
- Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers
- High-Density Hybrid Integration of III--V Compound Optoelectronics with Silicon Integrated Circuits
- Layer Transfer by Bonding and Laser Lift-Off
- Single-Crystal Lithium Niobate Films by Crystal Ion Slicing
- Wafer Bonding of Ferroelectric Materials
- Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications.

Rezensionen

From the reviews:
"Wafer bonding, also known as direct wafer bonding or wafer fusion, has developed from an almost obscure niche technology in the 1980s ... . Anyone interested in learning about the basics of wafer bonding and its various application areas, will likely be served by this outstanding volume while the researcher engaged in studies on applied and technological aspects of wafer bonding, will find up-to-date information about this fast-moving area, including relevant patent information." (Current Engineering Practice, Vol. 47 (3), 2004 - 2005)