Andere Kunden interessierten sich auch für
![Wafer-Level Chip-Scale Packaging]( "Wafer-Level Chip-Scale Packaging")
Wafer-Level Chip-Scale Packaging110,99 €![Semiconductor Power Devices]( "Semiconductor Power Devices")
Semiconductor Power Devices95,99 €![Transient and Permanent Error Control for Networks-on-Chip]( "Transient and Permanent Error Control for Networks-on-Chip")
Transient and Permanent Error Control for Networks-on-Chip74,99 €![CMOS High Efficiency On-chip Power Management]( "CMOS High Efficiency On-chip Power Management")
CMOS High Efficiency On-chip Power Management74,99 €![Analog Circuit Design for Process Variation-Resilient Systems-on-a-Chip]( "Analog Circuit Design for Process Variation-Resilient Systems-on-a-Chip")
Analog Circuit Design for Process Variation-Resilient Systems-on-a-Chip74,99 €![On-chip High-Voltage Generator Design]( "On-chip High-Voltage Generator Design")
On-chip High-Voltage Generator Design69,99 €![Wafer-Level Integrated Systems]( "Wafer-Level Integrated Systems")
Wafer-Level Integrated Systems125,99 €
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, theroleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
"Wafer Level Chip-Scale Packaging by Qu, Shichun, Liu, Yong presents good technical insights of wafer-level chip scale packaging (WLCSP) technology, suitable for both industry and academic practitioners. ... It is a good reference to demonstrate the alternate wafer-level chip scale packaging, and can serve as a very informative technical reference. ... The book is valuable as a learning tool for WLCSP and its clear relevance to real-world industry practices make it useful for both students and reliability practitioners." (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, August, 2015)