Air Cooling Technology for Electronic Equipment (eBook, ePUB)

Redaktion: Kim, Sung Jin; Lee, Sang Woo

• Format: ePub

Produktbeschreibung

Air Cooling Technology for Electronic Equipment answers questions frequently asked by thermal and packaging engineers. Providing problem-solving analyses that are jargon-free and easy to understand, it covers theoretical, numerical, and experimental analyses, includes detailed descriptions of 12 air cooling enhancement techniques, and discusses the

---

Dieser Download kann aus rechtlichen Gründen nur mit Rechnungsadresse in A, B, BG, CY, CZ, D, DK, EW, E, FIN, F, GR, HR, H, IRL, I, LT, L, LR, M, NL, PL, P, R, S, SLO, SK ausgeliefert werden.

Produktdetails

• Verlag: Taylor & Francis
• Seitenzahl: 272
• Erscheinungstermin: 24. Juli 2020
• Englisch
• ISBN-13: 9781000151749
• Artikelnr.: 59891733

Autorenporträt

Sung J. Kim and Sang W. Lee

Inhaltsangabe

Geometric Optimization of Cooling Techniques, A. BejanIntroductionStack of Parallel Vertical Plates Cooled by Natural ConvectionBundle of Horizontal Cylinders (Pin Fins) Cooled by Natural ConvectionStack of Parallel Plates Cooled by Laminar Forced ConvectionStack of Parallel Plates With Flush-Mounted and Protruding Heat SourcesStack of Parallel Plates Cooled by Turbulent Forced ConvectionStack of Parallel Plates Immersed in a Free StreamBundle of Cylinders Cooled by Forced ConvectionHeat Generating Plate Cooled Inside a Parallel Plate ChannelStacks of Plates Shielded by Porous ScreensPlate Fins with Variable Thickness and HeightHeat Sinks with Pin Fins and Plate FinsConclusionEntrance Design Correlations for Circuit Boards in Forced-Air Cooling, M. Faghri, M. Molki, and Y. AsakoIntroductionA New Correlation for Pressure DropA Correlation for Heat Transfer and Wake EffectA User-Friendly Program for Prediction of Array TemperatureConclusionForced Air Cooling of Low-Profile Package Arrays, R.A. WirtzIntroductionArray GeometryConvection ProcessesEstimation of Package TemperatureDetermination of h (sub K) and qPackage Heat Transfer - Uniform, In-line ArraysCoolant Pressure Drop - Uniform, In-Line ArraysNon-Uniform ArraysConclusionConjugate Heat Transfer in Forced Air Cooling of Electronic Components, A. OrtegaIntroductionBackgroundClassification of ProblemsTwo Dimensional Situation: Strip Source of Heat in Boundary Layer and Channel FlowThree Dimensional Situations: Rectangular Source of HeatClosureEnhanced Air Cooling of Electronic Equipment, S.V. GarimellaIntroductionEnhancement StrategiesEnhancement TechniquesPerformance Evaluation CriteriaClosureLimits of Air Cooling - A Methodological Approach, K. AzarIntroductionThermal Phenomena in Electronic EnclosuresThermal Coupling in Electronic