Jan A. Dziuban

Bonding in Microsystem Technology (eBook, PDF)

• Format: PDF

Produktbeschreibung

This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.

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Produktdetails

• Verlag: Springer Netherlands
• Seitenzahl: 334
• Erscheinungstermin: 30. Januar 2007
• Englisch
• ISBN-13: 9781402045899
• Artikelnr.: 37345290

Autorenporträt

Jan A. Dziuban, University of Technology, Wroclaw, Poland

Inhaltsangabe

Some Remarks on Microsystem Systematics and Development.- Deep, Three-Dimensional Silicon Micromachining.- Bonding.- Classification of Bonding and Closing Remarks.

Rezensionen

From the reviews: "Any one interested in bonding in microsystem technology will likely be well served by this outstanding volume which is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. ... Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students." (Current Engineering Practice, 2007)