Ceramic Interconnect Technology Handbook (eBook, PDF)

Redaktion: Barlow III, Fred D.; Elshabini, Aicha

• Format: PDF

Produktbeschreibung

With their unique electrical and thermal properties, ceramics are ideal for application in a wide variety of electronic systems and products. However, they are relegated either to a single chapter in electronic packaging books or to older, dated treatments. Offering much more than a discourse on the materials science behind these technologies, this book offers comprehensive, up-to-date coverage of all aspects of ceramic interconnect technologies in electronics and electronic packaging. The authors authoritatively discuss trends in electronic packaging, electrical design, simulation, and testing, ceramic materials, and the various types of ceramic interconnects, devices, and applications.

---

Dieser Download kann aus rechtlichen Gründen nur mit Rechnungsadresse in A, B, BG, CY, CZ, D, DK, EW, E, FIN, F, GR, HR, H, IRL, I, LT, L, LR, M, NL, PL, P, R, S, SLO, SK ausgeliefert werden.

Produktdetails

• Verlag: Taylor & Francis
• Seitenzahl: 456
• Erscheinungstermin: 3. Oktober 2018
• Englisch
• ISBN-13: 9781420018967
• Artikelnr.: 53315447

Autorenporträt

III Barlow, Aicha Elshabini

Inhaltsangabe

Overview of Ceramic Interconnect Technology. Electrical Design, Simulation,
and Testing. ThermoMechanical Design. Ceramic Materials. Screen Printing.
Multilayer Ceramics. Photo-Defined and Photo-Imaged Films. Copper
Interconnects for Ceramic Substrates and Packages. Integrated Passives in
Ceramic Substrates. Index.