Challenges in Mechanics of Biological Systems and Materials, Thermomechanics and Infrared Imaging, Time Dependent Materials and Residual Stress, Volume 2 (eBook, PDF)
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Challenges in Mechanics of Biological Systems and Materials, Thermomechanics and Infrared Imaging, Time Dependent Materials and Residual Stress , Volume 2 of the Proceedings of the 2023 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the second volume of five from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on fundamental and applied aspects of Experimental Mechanics, including papers in the following general technical research areas:
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Produktbeschreibung
Challenges in Mechanics of Biological Systems and Materials, Thermomechanics and Infrared Imaging, Time Dependent Materials and Residual Stress, Volume 2 of the Proceedings of the 2023 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the second volume of five from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on fundamental and applied aspects of Experimental Mechanics, including papers in the following general technical research areas:

Advanced Thermographic Techniques for SHM

AM Composites and Polymers

Experimental Techniques in Biomechanics and Mechanobiology

Inverse Methodologies and Uncertainties in the Identification of Residual Stresses, Residual Stress IV

Low Cost Thermographic Applications

Multiscale Mechanics of Biological Materials

NDE and Process Monitoring

Residual Stress

Thermomechanics
Time Dependence in Porous and Soft Materials
Autorenporträt
Christian Franck–University of Wisconsin-Madison, WI, USA; Karen Kasza–Columbia University, NY, USA; Jon Estrada, University of Michigan, MI, USA; Rosa De Finis–University of Salento, Italy; Geir Ólafsson–University of Bristol, UK; Suhasini Gururaja–Auburn University, AL, USA; Jevan Furmanski–University of Dayton Research Institute, OH, USA; Aaron Forster–National Institute of Standards and Technology, MD, USA; Pavan Kolluru–Texas A&M University, TX, USA; Mike Prime–Los Alamos National Laboratory, NM, USA; Tom Berfield–University of Louisville, KY, USA; Cahit Aydiner–Bogazici Universitesi, Turkey.