· Describes essential theory, practice and state-of-the-art applications of 2D and 3D Network-on-Chip interconnect;
· Enables readers to exploit parallelism in processor architecture, with interconnect design that is efficient in terms of energy and performance;
· Covers topics not available in other books, such as NoC and distributed memory organization, dynamic memory management and abstract data type support in many-core platforms, and distributed hierarchical power management.
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