Direct Copper Interconnection for Advanced Semiconductor Technology (eBook, PDF)

Redaktion: Shangguan, Dongkai

• Format: PDF

Produktbeschreibung

In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.

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Produktdetails

• Verlag: Taylor & Francis
• Seitenzahl: 462
• Erscheinungstermin: 28. Juni 2024
• Englisch
• ISBN-13: 9781040028643
• Artikelnr.: 70885761

Autorenporträt

Dr. Dongkai Shangguan, IEEE Fellow & IMAPS Fellow, is President of Thermal Engineering Associates, Inc., a provider of analog ASIC chips for thermal testing. He is also a Strategic Advisor to innovative companies in the global semiconductor and electronics industry. Previously, he served as Corporate Vice President for Technology & Engineering at Flex (formerly Flextronics), a global player for electronics design and manufacturing, and as Chief Marketing Officer at STATS ChipPAC (currently JCET), a leading provider of semiconductor assembly and test services. Early in his career, he held various technical and management responsibilities at Ford and Visteon on automotive electronics. Dr. Shangguan has published several books and authored/co-authored over 200 technical papers, and has been issued 32 U.S. patents. He is an IEEE EPS Distinguished Lecturer, and has given numerous keynotes, seminars and lectures globally. Dr. Shangguan has served on the iNEMI Board of Directors, the IEEE EPS Board of Governors, and the IPC Board of Directors. He has received a number of recognitions for his contributions to the industry, including the Electronics Manufacturing Technology Award and the Outstanding Sustained Technical Contribution Award from IEEE EPS, the William D. Ashman Achievement Award from IMAPS, the President's Award from IPC, and the Total Excellence in Electronics Manufacturing Award from the Society of Manufacturing Engineers. Dr. Shangguan received his B.Sc. degree in Mechanical Engineering from Tsinghua University, China, MBA degree from San Jose State University, and Ph.D. degree in Materials from the University of Oxford, U.K. He conducted post-doctoral teaching and research at the University of Cambridge and The University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan is based in San Jose, California, and travels globally in service of the industry.

Inhaltsangabe

Chapter 1: Advanced Packaging Landscape for Heterogeneous Integration Chapter 2: Direct Copper Interconnection for Die/Wafer Bonding: Overview Chapter 3: Hybrid Bonding Process Technology Chapter 4: Materials for Hybrif Bonding Chapter 5: Copper Electrodeposition for Advanced Packaging and Hybrid Bonding Chapter 6: Planarization for Advanced Packaging and Hybrid Chapter 7: Permanent and Temporary Wafer Bonding Chapter 8: Die-to-Wafer Hybrid Bonding for Direct Copper Intercon Chapter 9: Design for Hybrid Bonding and Chiplets Chapter 10: Thermal Modeling and Simulation for Advanced 3DIC Systems Chapter 11: Characterization, Modeling, and Reliability for Direct Copper Interconnection Chapter 12: Applications of Hybrid Bonding and Chiplets for Heterogeneous Integration