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  • Format: PDF

Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging, discussing the various electrical adhesive options currently available. The book focuses extensively on Electrically Conductive Adhesives (ECAs), as well as other adhesives such as lead-free soldering, Isotropically Conductive Adhesives (ICAs), Anisotropically Conductive Adhesives/Films (ACA/ACFs) and Nonconductive Adhesives/Films (NCA/NCFs). The authors also present examples of how conductive adhesives can be applied to nano techniques, while making important mentions of recent research and…mehr

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Produktbeschreibung
Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging, discussing the various electrical adhesive options currently available. The book focuses extensively on Electrically Conductive Adhesives (ECAs), as well as other adhesives such as lead-free soldering, Isotropically Conductive Adhesives (ICAs), Anisotropically Conductive Adhesives/Films (ACA/ACFs) and Nonconductive Adhesives/Films (NCA/NCFs). The authors also present examples of how conductive adhesives can be applied to nano techniques, while making important mentions of recent research and development breakthroughs in the fields.

Drawing upon tireless research, years of theoretical development and practical experience, and utilizing numerous visual examples and illustrative applications, authors CP Wong, Yi Li and Daniel Lu cover electrically conductive adhesives in depth, while also describing:



  • The electrical properties, thermal performance, bonding pressure, assembly and reliability of numerous types of electrically conductive adhesives


  • The similarities and differences between lead-free soldering techniques and electrically conductive adhesives, while also discussing the advantages of ECAs.


  • Insights into the future of nano ECAs, as well as projections of future industry trends.




Electrical Conductive Adhesives with Nanotechnologies is a must-read for both researchers and active engineers in the electronic packaging field.


Dieser Download kann aus rechtlichen Gründen nur mit Rechnungsadresse in A, B, BG, CY, CZ, D, DK, EW, E, FIN, F, GR, HR, H, IRL, I, LT, L, LR, M, NL, PL, P, R, S, SLO, SK ausgeliefert werden.

Rezensionen
From the reviews:
"This book is a review of the most recent advances in various types of electrically conductive adhesives, with a focus on emerging nanotechnology, including materials development and characterizations ... . Our readers who are materials scientists and materials engineers who develop electrically conductive adhesives and conductive polymers for microelectronics applications would definitely find this book very interesting. It is an excellent resource of current ECA materials, processes, and technology ... . This is truly a worthwhile reference book to own for those develop ECAs." (Electrical Insulation Magazine, Vol. 27 (2), March/April, 2011)