Drawing upon tireless research, years of theoretical development and practical experience, and utilizing numerous visual examples and illustrative applications, authors CP Wong, Yi Li and Daniel Lu cover electrically conductive adhesives in depth, while also describing:
- The electrical properties, thermal performance, bonding pressure, assembly and reliability of numerous types of electrically conductive adhesives
- The similarities and differences between lead-free soldering techniques and electrically conductive adhesives, while also discussing the advantages of ECAs.
- Insights into the future of nano ECAs, as well as projections of future industry trends.
Electrical Conductive Adhesives with Nanotechnologies is a must-read for both researchers and active engineers in the electronic packaging field.
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"This book is a review of the most recent advances in various types of electrically conductive adhesives, with a focus on emerging nanotechnology, including materials development and characterizations ... . Our readers who are materials scientists and materials engineers who develop electrically conductive adhesives and conductive polymers for microelectronics applications would definitely find this book very interesting. It is an excellent resource of current ECA materials, processes, and technology ... . This is truly a worthwhile reference book to own for those develop ECAs." (Electrical Insulation Magazine, Vol. 27 (2), March/April, 2011)