Paul S. Ho

Electromigration in Metals (eBook, PDF)

Fundamentals to Nano-Interconnects

• Format: PDF

Produktbeschreibung

Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.

---

Dieser Download kann aus rechtlichen Gründen nur mit Rechnungsadresse in A, B, BG, CY, CZ, D, DK, EW, E, FIN, F, GR, HR, H, IRL, I, LT, L, LR, M, NL, PL, P, R, S, SLO, SK ausgeliefert werden.

Produktdetails

• Verlag: Cambridge University Press
• Erscheinungstermin: 12. Mai 2022
• Englisch
• ISBN-13: 9781009287791
• Artikelnr.: 66177608

Autorenporträt

Paul Ho is Professor Emeritus in the Department of Mechanical Engineering and the Texas Materials Institute at the University of Texas at Austin. He has received research awards from the Electrochemical Society, IEEE, IITC and Semiconductor Industry Association, among others.

Inhaltsangabe

1. Introduction to electromigration; 2. Fundamentals of electromigration;
3. Thermal stress characteristics and stress induced void formation in
aluminium and copper interconnects; 4. Stress evolution and damage
formation in confined metal lines under electric stressing; 5.
Electromigration in Cu interconnect structures; 6. Scaling effects on
microstructure and resistivity of Cu and Co nanointerconnects; Analysis of
electromigration induced stress evolution and voiding in Cu damascene lines
with microstructure; 8. Massive scale statistical studies for
electromigration; 9. Assessment of electromigration damage in large on-chip
power grids. Index.