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Examines the foundation of pulse power technology in detail to optimize the technology in modern engineering settings Pulsed power technologies could be an answer to many cutting-edge applications. The challenge is in how to develop this high-power/high-energy technology to fit current market demands of low-energy consuming applications. This book provides a comprehensive look at pulsed power technology and shows how it can be improved upon for the world of today and tomorrow. Foundations of Pulsed Power Technology focuses on the design and construction of the building blocks as well as their…mehr
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- Produktdetails
- Verlag: Wiley-Scrivener
- Seitenzahl: 672
- Erscheinungstermin: 6. Juli 2017
- Englisch
- ISBN-13: 9781119301172
- Artikelnr.: 52578375
- Verlag: Wiley-Scrivener
- Seitenzahl: 672
- Erscheinungstermin: 6. Juli 2017
- Englisch
- ISBN-13: 9781119301172
- Artikelnr.: 52578375
) 271 5.4.2.3 Switching Time Behavior 271 5.4.2.4 Efficiency of EBCS 274 5.4.2.5 Discharge Instabilities 276 5.4.2.6 Switch Dielectric 277 5.4.2.7 Switch Dimensions 278 5.4.3 Vacuum Arc Switch 280 5.4.3.1 Mechanical Breaker 280 5.4.3.2 Magnetic Vacuum Breaker 282 5.4.3.3 Mechanical Magnetic Vacuum Breaker 283 5.4.4 Explosive Switch 284 5.4.5 Explosive Plasma Switch 286 5.4.6 Plasma Erosion Switch 286 5.4.7 Dense Plasma Focus 287 5.4.8 Plasma Implosion Switch 289 5.4.9 Reflex Switch 290 5.4.10 Crossed Field Tube 291 5.4.11 Miscellaneous 293 5.5 Design Example 294 References 295 6 Multigigawatt to Multiterawatt Systems 303 6.1 Capacitive Storage 305 6.1.1 Primary Capacitor Storage 305 6.1.2 Primary-Intermediate Capacitor Storage 306 6.1.3 Primary-Intermediate-Fast Capacitor Storage 307 6.1.3.1 Fast Marx Generator 308 6.1.4 Parallel Operation of Marx Generators 308 6.1.5 Pulse Forming Line Requirements for Optimum Performance 309 6.1.5.1 Peak Power Delivery into a Matched Load 309 6.1.5.2 Low-Impedance PFLs 310 6.1.5.3 Pulse Time Compression 310 6.2 Inductive Storage Systems 311 6.2.1 Primary Inductor Storage 311 6.2.2 Cascaded Inductor Storage 311 6.3 Magnetic Pulse Compression 313 6.4 Inductive Voltage Adder 315 6.5 Induction Linac Techniques 317 6.5.1 Magnetic Core Induction Linacs 317 6.5.2 Pulsed Line Induction Linacs 319 6.5.3 Autoaccelerator Induction Linac 322 6.6 Design Examples 323 References 328 7 Energy Storage in Capacitor Banks 331 7.1 Basic Equations 331 7.1.1 Case 1: Lossless, Undamped Circuit
= 0 333 7.1.2 Case 2: Overdamped Circuit
> 1 334 7.1.3 Case 3: Underdamped Circuit
< 1 336 7.1.4 Case 4: Critically Damped Circuit
= 1 336 7.1.5 Comparison of Circuit Responses 337 7.2 Capacitor Bank Circuit Topology 338 7.2.1 Equivalent Circuit of a Low-Energy Capacitor Bank 339 7.2.2 Equivalent Circuit of a High-Energy Capacitor Bank 340 7.3 Charging Supply 342 7.3.1 Constant Voltage (Resistive) Charging 342 7.3.2 Constant Current Charging 344 7.3.3 Constant Power Charging 345 7.4 Components of a Capacitor Bank 345 7.4.1 Energy Storage Capacitor 346 7.4.1.1 Capacitor Parameters 347 7.4.1.2 Test Methods 349 7.4.1.3 Pulse Repetition Frequency 349 7.4.1.4 Recent Advances 349 7.4.2 Trigger Pulse Generator 350 7.4.3 Transmission Lines 352 7.4.3.1 Coaxial Cables 353 7.4.3.2 Sandwich Lines 355 7.4.4 Power Feed 356 7.5 Safety 357 7.6 Typical Capacitor Bank Configurations 361 7.7 Example Problems 363 References 366 8 Electrical Breakdown in Gases 369 8.1 Kinetic Theory of Gases 369 8.1.1 The Kinetic Theory of Neutral Gases 370 8.1.1.1 Maxwell-Boltzmann Distribution of Velocities 371 8.1.1.2 Mean Free Path 373 8.1.2 The Kinetic Theory of Ionized Gases 377 8.1.2.1 Energy Gained from the Electric Field 378 8.1.2.2 Elastic Collisions 378 8.1.2.3 Inelastic Collisions 379 8.1.2.4 Total Collisional Cross Section 383 8.2 Early Experiments in Electrical Breakdown 384 8.2.1 Paschen's Law 384 8.2.2 Townsend's Experiments 385 8.2.2.1 Region I: The Ionization-Free Region 386 8.2.2.2 Region II: The Townsend First Ionization Region 386 8.2.2.3 Region III: Townsend Second Ionization Region 387 8.2.3 Paschen's Law Revisited 387 8.2.4 The Electron Avalanche 391 8.3 Mechanisms of Spark Formation 393 8.3.1 The Townsend Discharge 394 8.3.1.1 Multiple Secondary Mechanisms 396 8.3.1.2 Generalized Townsend Breakdown Criterion 398 8.3.1.3 Townsend Criterion in Nonuniform Geometries 399 8.3.1.4 Modifications for Electronegative Gases 400 8.3.2 Theory of the Streamer Mechanism 400 8.3.2.1 Criterion for Streamer Onset 401 8.3.2.2 The Electric Field Along the Avalanche 406 8.3.2.3 A Qualitative Description of Streamer Formation 407 8.3.2.4 Streamer Criterion in Nonuniform Electric Fields 410 8.3.2.5 The Overvolted Streamer 411 8.3.2.6 Pedersen's Criterion 412 8.4 The Corona Discharge 413 8.5 Pseudospark Discharges 415 8.5.1 The Prebreakdown Regime 415 8.5.2 Breakdown Regime 416 8.6 Breakdown Behavior of Gaseous SF6 417 8.6.1 Electrode Material 418 8.6.2 Surface Area and Surface Finish 418 8.6.3 Gap Spacing and High Pressures 419 8.6.4 Insulating Spacer 420 8.6.5 Contamination by Conducting Particles 420 8.7 Intershields for Optimal Use of Insulation 421 8.7.1 Cylindrical Geometry 421 8.7.1.1 Two-Electrode Concentric Cylinders 422 8.7.1.2 Cylindrical Geometry with an Intershield 423 8.7.1.3 Intershield Effectiveness 426 8.7.2 Spherical Geometry 426 8.7.2.1 Two Concentric Spheres 426 8.7.2.2 A Spherical Geometry with an Intershield 426 8.8 Design Examples 427 References 433 9 Electrical Breakdown in Solids, Liquids, and Vacuum 439 9.1 Solids 439 9.1.1 Breakdown Mechanisms in Solids 440 9.1.1.1 Intrinsic Breakdown 440 9.1.1.2 Thermal Breakdown 442 9.1.1.3 Electromechanical Breakdown 444 9.1.1.4 Partial Discharges 445 9.1.1.5 Electrical Trees 447 9.1.2 Methods of Improving Solid Insulator Performance 449 9.1.2.1 Insulation in Energy Storage Capacitors 449 9.1.2.2 Surge Voltage Distribution in a Tesla Transformer 449 9.1.2.3 Surface Flashover in Standoff Insulators 450 9.1.2.4 General Care for Fabrication and Assembly 452 9.2 Liquids 452 9.2.1 Breakdown Mechanisms in Liquids 452 9.2.1.1 Particle Alignment 452 9.2.1.2 Electronic Breakdown 453 9.2.1.3 Streamers in Bubbles 453 9.2.2 Mechanisms of Bubble Formation 455 9.2.2.1 Krasucki's Hypothesis 455 9.2.2.2 Kao's Hypothesis 455 9.2.2.3 Sharbaugh and Watson Hypothesis 456 9.2.3 Breakdown Features of Water 457 9.2.3.1 Dependence of Breakdown Strength on Pulse Duration 457 9.2.3.2 Dependence of Breakdown Voltage on Polarity 457 9.2.3.3 Electric Field Intensification 457 9.2.4 Methods of Improving Liquid Dielectric Performance 457 9.2.4.1 New Compositions 458 9.2.4.2 Addition of Electron Scavengers 458 9.2.4.3 Liquid Mixtures 458 9.2.4.4 Impregnation 458 9.2.4.5 Purification 459 9.3 Vacuum 459 9.3.1 Vacuum Breakdown Mechanisms 459 9.3.1.1 ABCD Mechanism 460 9.3.1.2 Field Emission-Initiated Breakdown 460 9.3.1.3 Microparticle-Initiated Breakdown 462 9.3.1.4 Plasma Flare-Initiated Breakdown 463 9.3.2 Improving Vacuum Insulation Performance 464 9.3.2.1 Conditioning 464 9.3.2.2 Surface Treatment and Coatings 467 9.3.3 Triple-Point Junction Modifications 467 9.3.4 Vacuum Magnetic Insulation 468 9.3.5 Surface Flashover Across Solids in Vacuum 471 9.3.5.1 Secondary Electron Emission from Dielectric Surfaces 471 9.3.5.2 Saturated Secondary Electron Emission Avalanche 473 9.4 Composite Dielectrics 479 9.5 Design Examples 481 References 486 10 Pulsed Voltage and Current Measurements 493 10.1 Pulsed Voltage Measurement 493 10.1.1 Spark Gaps 493 >1
s) 494 10.1.1.2 Peak Voltage of Pulses (<1
s) 495 10.1.2 Crest Voltmeters 496 10.1.3 Voltage Dividers 498 10.1.3.1 Resistive Divider 498 10.1.3.2 Capacitive Dividers 507 10.1.4 Electro-optical Techniques 511 10.1.4.1 The Kerr Cell 511 10.1.4.2 The Pockels Cell 515 10.1.5 Reflection Attenuator 518 10.2 Pulsed Current Measurement 519 10.2.1 Current Viewing Resistor 519 10.2.1.1 Energy Capacity 519 10.2.1.2 Configurations 520 10.2.1.3 Tolerance in Resistance 521 10.2.1.4 Physical Dimensions 523 10.2.1.5 Frequency Response 523 10.2.2 Rogowski Coil 523 10.2.2.1 Voltage Induced in the Rogowski Coil 524 10.2.2.2 Compensated Rogowski Coil 525 10.2.2.3 Self-Integrating Rogowski Coil 527 10.2.2.4 Construction 529 10.2.3 Inductive (B-dot) Probe 529 10.2.4 Current Transformer 530 10.2.5 Magneto-optic Current Transformer 530 10.2.5.1 Basic Principles 531 10.2.5.2 Intensity Relations for Single-Beam Detector 532 10.2.5.3 Intensity Relations for Differential Split-Beam Detector 532 10.2.5.4 Light Source 533 10.2.5.5 Magneto-optic Sensor 533 10.2.5.6 Frequency Response 533 10.2.5.7 Device Configurations 533 10.3 Design Examples 535 References 538 11 Electromagnetic Interference and Noise Suppression 547 11.1 Interference Coupling Modes 547 11.1.1 Coupling in Long Transmission Lines 548 11.1.1.1 Capacitive Coupling 548 11.1.1.2 Radiative Coupling 550 11.1.1.3 Inductive Coupling 550 11.1.2 Common Impedance Coupling 550 11.1.3 Coupling of Short Transmission Lines over a Ground Plane 551 11.1.3.1 Voltages Induced by Transients 553 11.1.3.2 Modification of Inductances by the Ground Plane 556 11.2 Noise Suppression Techniques 559 11.2.1 Shielded Enclosure 559 11.2.1.1 Absorption Loss (A) 561 11.2.1.2 Reflection Loss (R) 561 11.2.1.3 Correction Factor (ß) 563 11.2.1.4 Shielding Effectiveness for Plane Waves 563 11.2.1.5 Shielding Effectiveness for High-Impedance E and Low-Impedance H Fields 564 11.2.1.6 Typical Shielding Effectiveness of a Simple Practical Enclosure 565 11.2.1.7 Twisted Shielded Pair 565 11.2.2 Grounding and Ground Loops 566 11.2.2.1 Low-Impedance Bypass Path 567 11.2.2.2 Single-Point Grounding 568 11.2.2.3 Breaking Ground Loops with Optical Isolation 568 11.2.3 Power Line Filters 569 11.2.3.1 Types of Filters 569 11.2.3.2 Insertion Loss 570 11.2.4 Isolation Transformer 571 11.3 Well-Shielded Equipment Topology 572 11.3.1 High-Interference Immunity Measurement System 574 11.3.2 Immunity Technique for Free Field Measurements 575 11.4 Design Examples 575 References 581 12 EM Topology for Interference Control 585 12.1 Topological Design 586 12.1.1 Series Decomposition 587 12.1.2 Parallel Decomposition 588 12.2 Shield Penetrations 589 12.2.1 Necessity for Grounding 590 12.2.2 Grounding Conductors 591 12.2.3 Groundable Conductors 592 12.2.4 Insulated Conductors 592 12.3 Shield Apertures 595 12.4 Diffusive Penetration 597 12.4.1 Cavity Fields 599 12.4.1.1 Frequency Domain Solutions 600 12.4.1.2 Time Domain Solutions 601 12.4.2 Single Panel Entry 603 12.4.3 Voltages Induced by Diffusive Penetration 604 12.5 Design Examples 604 References 606 Index 609
) 271 5.4.2.3 Switching Time Behavior 271 5.4.2.4 Efficiency of EBCS 274 5.4.2.5 Discharge Instabilities 276 5.4.2.6 Switch Dielectric 277 5.4.2.7 Switch Dimensions 278 5.4.3 Vacuum Arc Switch 280 5.4.3.1 Mechanical Breaker 280 5.4.3.2 Magnetic Vacuum Breaker 282 5.4.3.3 Mechanical Magnetic Vacuum Breaker 283 5.4.4 Explosive Switch 284 5.4.5 Explosive Plasma Switch 286 5.4.6 Plasma Erosion Switch 286 5.4.7 Dense Plasma Focus 287 5.4.8 Plasma Implosion Switch 289 5.4.9 Reflex Switch 290 5.4.10 Crossed Field Tube 291 5.4.11 Miscellaneous 293 5.5 Design Example 294 References 295 6 Multigigawatt to Multiterawatt Systems 303 6.1 Capacitive Storage 305 6.1.1 Primary Capacitor Storage 305 6.1.2 Primary-Intermediate Capacitor Storage 306 6.1.3 Primary-Intermediate-Fast Capacitor Storage 307 6.1.3.1 Fast Marx Generator 308 6.1.4 Parallel Operation of Marx Generators 308 6.1.5 Pulse Forming Line Requirements for Optimum Performance 309 6.1.5.1 Peak Power Delivery into a Matched Load 309 6.1.5.2 Low-Impedance PFLs 310 6.1.5.3 Pulse Time Compression 310 6.2 Inductive Storage Systems 311 6.2.1 Primary Inductor Storage 311 6.2.2 Cascaded Inductor Storage 311 6.3 Magnetic Pulse Compression 313 6.4 Inductive Voltage Adder 315 6.5 Induction Linac Techniques 317 6.5.1 Magnetic Core Induction Linacs 317 6.5.2 Pulsed Line Induction Linacs 319 6.5.3 Autoaccelerator Induction Linac 322 6.6 Design Examples 323 References 328 7 Energy Storage in Capacitor Banks 331 7.1 Basic Equations 331 7.1.1 Case 1: Lossless, Undamped Circuit
= 0 333 7.1.2 Case 2: Overdamped Circuit
> 1 334 7.1.3 Case 3: Underdamped Circuit
< 1 336 7.1.4 Case 4: Critically Damped Circuit
= 1 336 7.1.5 Comparison of Circuit Responses 337 7.2 Capacitor Bank Circuit Topology 338 7.2.1 Equivalent Circuit of a Low-Energy Capacitor Bank 339 7.2.2 Equivalent Circuit of a High-Energy Capacitor Bank 340 7.3 Charging Supply 342 7.3.1 Constant Voltage (Resistive) Charging 342 7.3.2 Constant Current Charging 344 7.3.3 Constant Power Charging 345 7.4 Components of a Capacitor Bank 345 7.4.1 Energy Storage Capacitor 346 7.4.1.1 Capacitor Parameters 347 7.4.1.2 Test Methods 349 7.4.1.3 Pulse Repetition Frequency 349 7.4.1.4 Recent Advances 349 7.4.2 Trigger Pulse Generator 350 7.4.3 Transmission Lines 352 7.4.3.1 Coaxial Cables 353 7.4.3.2 Sandwich Lines 355 7.4.4 Power Feed 356 7.5 Safety 357 7.6 Typical Capacitor Bank Configurations 361 7.7 Example Problems 363 References 366 8 Electrical Breakdown in Gases 369 8.1 Kinetic Theory of Gases 369 8.1.1 The Kinetic Theory of Neutral Gases 370 8.1.1.1 Maxwell-Boltzmann Distribution of Velocities 371 8.1.1.2 Mean Free Path 373 8.1.2 The Kinetic Theory of Ionized Gases 377 8.1.2.1 Energy Gained from the Electric Field 378 8.1.2.2 Elastic Collisions 378 8.1.2.3 Inelastic Collisions 379 8.1.2.4 Total Collisional Cross Section 383 8.2 Early Experiments in Electrical Breakdown 384 8.2.1 Paschen's Law 384 8.2.2 Townsend's Experiments 385 8.2.2.1 Region I: The Ionization-Free Region 386 8.2.2.2 Region II: The Townsend First Ionization Region 386 8.2.2.3 Region III: Townsend Second Ionization Region 387 8.2.3 Paschen's Law Revisited 387 8.2.4 The Electron Avalanche 391 8.3 Mechanisms of Spark Formation 393 8.3.1 The Townsend Discharge 394 8.3.1.1 Multiple Secondary Mechanisms 396 8.3.1.2 Generalized Townsend Breakdown Criterion 398 8.3.1.3 Townsend Criterion in Nonuniform Geometries 399 8.3.1.4 Modifications for Electronegative Gases 400 8.3.2 Theory of the Streamer Mechanism 400 8.3.2.1 Criterion for Streamer Onset 401 8.3.2.2 The Electric Field Along the Avalanche 406 8.3.2.3 A Qualitative Description of Streamer Formation 407 8.3.2.4 Streamer Criterion in Nonuniform Electric Fields 410 8.3.2.5 The Overvolted Streamer 411 8.3.2.6 Pedersen's Criterion 412 8.4 The Corona Discharge 413 8.5 Pseudospark Discharges 415 8.5.1 The Prebreakdown Regime 415 8.5.2 Breakdown Regime 416 8.6 Breakdown Behavior of Gaseous SF6 417 8.6.1 Electrode Material 418 8.6.2 Surface Area and Surface Finish 418 8.6.3 Gap Spacing and High Pressures 419 8.6.4 Insulating Spacer 420 8.6.5 Contamination by Conducting Particles 420 8.7 Intershields for Optimal Use of Insulation 421 8.7.1 Cylindrical Geometry 421 8.7.1.1 Two-Electrode Concentric Cylinders 422 8.7.1.2 Cylindrical Geometry with an Intershield 423 8.7.1.3 Intershield Effectiveness 426 8.7.2 Spherical Geometry 426 8.7.2.1 Two Concentric Spheres 426 8.7.2.2 A Spherical Geometry with an Intershield 426 8.8 Design Examples 427 References 433 9 Electrical Breakdown in Solids, Liquids, and Vacuum 439 9.1 Solids 439 9.1.1 Breakdown Mechanisms in Solids 440 9.1.1.1 Intrinsic Breakdown 440 9.1.1.2 Thermal Breakdown 442 9.1.1.3 Electromechanical Breakdown 444 9.1.1.4 Partial Discharges 445 9.1.1.5 Electrical Trees 447 9.1.2 Methods of Improving Solid Insulator Performance 449 9.1.2.1 Insulation in Energy Storage Capacitors 449 9.1.2.2 Surge Voltage Distribution in a Tesla Transformer 449 9.1.2.3 Surface Flashover in Standoff Insulators 450 9.1.2.4 General Care for Fabrication and Assembly 452 9.2 Liquids 452 9.2.1 Breakdown Mechanisms in Liquids 452 9.2.1.1 Particle Alignment 452 9.2.1.2 Electronic Breakdown 453 9.2.1.3 Streamers in Bubbles 453 9.2.2 Mechanisms of Bubble Formation 455 9.2.2.1 Krasucki's Hypothesis 455 9.2.2.2 Kao's Hypothesis 455 9.2.2.3 Sharbaugh and Watson Hypothesis 456 9.2.3 Breakdown Features of Water 457 9.2.3.1 Dependence of Breakdown Strength on Pulse Duration 457 9.2.3.2 Dependence of Breakdown Voltage on Polarity 457 9.2.3.3 Electric Field Intensification 457 9.2.4 Methods of Improving Liquid Dielectric Performance 457 9.2.4.1 New Compositions 458 9.2.4.2 Addition of Electron Scavengers 458 9.2.4.3 Liquid Mixtures 458 9.2.4.4 Impregnation 458 9.2.4.5 Purification 459 9.3 Vacuum 459 9.3.1 Vacuum Breakdown Mechanisms 459 9.3.1.1 ABCD Mechanism 460 9.3.1.2 Field Emission-Initiated Breakdown 460 9.3.1.3 Microparticle-Initiated Breakdown 462 9.3.1.4 Plasma Flare-Initiated Breakdown 463 9.3.2 Improving Vacuum Insulation Performance 464 9.3.2.1 Conditioning 464 9.3.2.2 Surface Treatment and Coatings 467 9.3.3 Triple-Point Junction Modifications 467 9.3.4 Vacuum Magnetic Insulation 468 9.3.5 Surface Flashover Across Solids in Vacuum 471 9.3.5.1 Secondary Electron Emission from Dielectric Surfaces 471 9.3.5.2 Saturated Secondary Electron Emission Avalanche 473 9.4 Composite Dielectrics 479 9.5 Design Examples 481 References 486 10 Pulsed Voltage and Current Measurements 493 10.1 Pulsed Voltage Measurement 493 10.1.1 Spark Gaps 493 >1
s) 494 10.1.1.2 Peak Voltage of Pulses (<1
s) 495 10.1.2 Crest Voltmeters 496 10.1.3 Voltage Dividers 498 10.1.3.1 Resistive Divider 498 10.1.3.2 Capacitive Dividers 507 10.1.4 Electro-optical Techniques 511 10.1.4.1 The Kerr Cell 511 10.1.4.2 The Pockels Cell 515 10.1.5 Reflection Attenuator 518 10.2 Pulsed Current Measurement 519 10.2.1 Current Viewing Resistor 519 10.2.1.1 Energy Capacity 519 10.2.1.2 Configurations 520 10.2.1.3 Tolerance in Resistance 521 10.2.1.4 Physical Dimensions 523 10.2.1.5 Frequency Response 523 10.2.2 Rogowski Coil 523 10.2.2.1 Voltage Induced in the Rogowski Coil 524 10.2.2.2 Compensated Rogowski Coil 525 10.2.2.3 Self-Integrating Rogowski Coil 527 10.2.2.4 Construction 529 10.2.3 Inductive (B-dot) Probe 529 10.2.4 Current Transformer 530 10.2.5 Magneto-optic Current Transformer 530 10.2.5.1 Basic Principles 531 10.2.5.2 Intensity Relations for Single-Beam Detector 532 10.2.5.3 Intensity Relations for Differential Split-Beam Detector 532 10.2.5.4 Light Source 533 10.2.5.5 Magneto-optic Sensor 533 10.2.5.6 Frequency Response 533 10.2.5.7 Device Configurations 533 10.3 Design Examples 535 References 538 11 Electromagnetic Interference and Noise Suppression 547 11.1 Interference Coupling Modes 547 11.1.1 Coupling in Long Transmission Lines 548 11.1.1.1 Capacitive Coupling 548 11.1.1.2 Radiative Coupling 550 11.1.1.3 Inductive Coupling 550 11.1.2 Common Impedance Coupling 550 11.1.3 Coupling of Short Transmission Lines over a Ground Plane 551 11.1.3.1 Voltages Induced by Transients 553 11.1.3.2 Modification of Inductances by the Ground Plane 556 11.2 Noise Suppression Techniques 559 11.2.1 Shielded Enclosure 559 11.2.1.1 Absorption Loss (A) 561 11.2.1.2 Reflection Loss (R) 561 11.2.1.3 Correction Factor (ß) 563 11.2.1.4 Shielding Effectiveness for Plane Waves 563 11.2.1.5 Shielding Effectiveness for High-Impedance E and Low-Impedance H Fields 564 11.2.1.6 Typical Shielding Effectiveness of a Simple Practical Enclosure 565 11.2.1.7 Twisted Shielded Pair 565 11.2.2 Grounding and Ground Loops 566 11.2.2.1 Low-Impedance Bypass Path 567 11.2.2.2 Single-Point Grounding 568 11.2.2.3 Breaking Ground Loops with Optical Isolation 568 11.2.3 Power Line Filters 569 11.2.3.1 Types of Filters 569 11.2.3.2 Insertion Loss 570 11.2.4 Isolation Transformer 571 11.3 Well-Shielded Equipment Topology 572 11.3.1 High-Interference Immunity Measurement System 574 11.3.2 Immunity Technique for Free Field Measurements 575 11.4 Design Examples 575 References 581 12 EM Topology for Interference Control 585 12.1 Topological Design 586 12.1.1 Series Decomposition 587 12.1.2 Parallel Decomposition 588 12.2 Shield Penetrations 589 12.2.1 Necessity for Grounding 590 12.2.2 Grounding Conductors 591 12.2.3 Groundable Conductors 592 12.2.4 Insulated Conductors 592 12.3 Shield Apertures 595 12.4 Diffusive Penetration 597 12.4.1 Cavity Fields 599 12.4.1.1 Frequency Domain Solutions 600 12.4.1.2 Time Domain Solutions 601 12.4.2 Single Panel Entry 603 12.4.3 Voltages Induced by Diffusive Penetration 604 12.5 Design Examples 604 References 606 Index 609