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This is the first English language book to describe the most precise processes available for finishing the surfaces of mechanical as well as electronics and semiconductor components. The Handbook of Lapping and Polishing begins with an introduction focused on the fundamental concepts and the basics of lapping and polishing processes. The book builds on this foundation to discuss lapping of ductile and brittle materials, with a special chapter devoted to lapping equipment. Sections on polishing and chemical-mechanical polishing (CMP) round out the discussion. Experts from the US, Germany, and Japan present the latest technologies for lapping and polishing along with case studies.
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