Handbook of Wafer Bonding (eBook, ePUB)

Redaktion: Ramm, Peter; Taklo, Maaike M. V.; Lu, James Jian-Qiang

• Format: ePub

Produktbeschreibung

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.

Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.

This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

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Produktdetails

• Verlag: Wiley-VCH
• Erscheinungstermin: 17. November 2011
• Englisch
• ISBN-13: 9783527644230
• Artikelnr.: 41366347