The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.
Provides the first handbook to cover all aspects of compound semiconductor device reliability
Systematically describes research results on reliability and materials issues of both optical and electron devices developed since 2000
Covers characterization techniques needed to understand failure mechanisms in compound semiconductor devices
Includes experimental approaches in reliability studies
Presents case studies of laser degradation and HEMT degradation
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