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  • Format: ePub

Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. It discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation and how materials could enable these security solutions. The book introduces the opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address…mehr

Produktbeschreibung
Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. It discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation and how materials could enable these security solutions. The book introduces the opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges.

Materials for Electronics Security and Assurance is suitable for materials scientists and engineers to enable future research directions, current computer and hardware security engineers to enable materials selection, and to inspire cross-collaboration between both communities.
  • Discusses materials as enablers to provide electronics assurance, counterfeit detection/protection, and fingerprinting
  • Provides an overview of benefits and challenges of materials-based security solutions to inspire future materials research directions
  • Includes an introduction to material perspectives on hardware security to enable cross collaboration between materials, design, and testing

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Autorenporträt
Navid Asadi is an assistant professor in the department of electrical and computer engineering at university of Florida. His research is mainly focused on physical inspection of electronics from device to system level. He investigates novel techniques for integrated circuits counterfeit detection/prevention, system and chip level reverse engineering, anti-reverse engineering, invasive and semi-invasive physical attacks, integrity analysis, etc. using advanced inspection methods including but not limited to 3D X-ray microscopy, Optical imaging, scanning electron microscopy (SEM), focused ion beams (FIBs), THz imaging, etc. in combination with image processing and machine learning algorithms to make the inspection process intelligent and independent from human. He has received several best paper awards and is the co-founder of the IEEE-PAINE conference.