Moisture Sensitivity of Plastic Packages of IC Devices (eBook, PDF)

Redaktion: Fan, X. J.; Suhir, E.

• Format: PDF

Produktbeschreibung

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: .Thorough exploration of moisture's effects based on lectures and tutorials by the authors .Consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging .Emerging theories and cutting-edge industrial applications presented by the leading professionals in the field Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

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Produktdetails

• Verlag: Springer US
• Seitenzahl: 558
• Erscheinungstermin: 23. Juli 2010
• Englisch
• ISBN-13: 9781441957191
• Artikelnr.: 37342237

Inhaltsangabe

Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-Induced Damages in Polymeric Materials in Electronic Packaging.- Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds.- Real-Time Characterization of Moisture Absorption and Desorption.- Modeling of Moisture Diffusion and Whole-Field Vapor Pressure in Plastic Packages of IC Devices.- Characterization of Hygroscopic Deformations by Moiré Interferometry.- Characterization of Interfacial Hydrothermal Strength of Sandwiched Assembly Using Photomechanics Measurement Techniques.- Hygroscopic Swelling of Polymeric Materials in Electronic Packaging: Characterization and Analysis.- Modeling of Moisture Diffusion and Moisture-Induced Stresses in Semiconductor and MEMS Packages.- Methodology for Integrated Vapor Pressure, Hygroswelling, and Thermo-mechanical Stress Modeling of IC Packages.- Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application and Extension of the Theory of Thin Plates of Large Deflections.- Continuum Theory in Moisture-Induced Failures of Encapsulated IC Devices.- Mechanism-Based Modeling of Thermal- and Moisture-Induced Failure of IC Devices.- New Method for Equivalent Acceleration of IPC/JEDEC Moisture Sensitivity Levels.- Moisture Sensitivity Level (MSL) Capability of Plastic-Encapsulated Packages.- Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages.- Industrial Applications of Moisture-Related Reliability Problems.- Underfill Selection Against Moisture in Flip Chip BGA Packages.- Moisture Sensitivity Investigations of 3D Stacked-Die Chip-Scale Packages (SCSPs).- Automated Simulation System of Moisture Diffusion and Hygrothermal Stress for MicroelectronicPackaging.- Moisture-Driven Electromigrative Degradation in Microelectronic Packages.- Interfacial Moisture Diffusion: Molecular Dynamics Simulation and Experimental Evaluation.