Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu

Packaging of High Power Semiconductor Lasers (eBook, PDF)

• Format: PDF

Produktbeschreibung

This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.

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Produktdetails

• Verlag: Springer New York
• Seitenzahl: 402
• Erscheinungstermin: 14. Juli 2014
• Englisch
• ISBN-13: 9781461492634
• Artikelnr.: 43791610

Autorenporträt

Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi'an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.

Inhaltsangabe

Introduction of High Power Semiconductor Lasers.- Overview of High Power Semiconductor Laser Packages.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress in High Power Semiconductor Lasers.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Packaging Process of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.- Development Trend and Challenges in High Power Semiconductor Laser Packaging.