provides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,
electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacture
microelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments in
this field.
* Presents most recent advances in the use of polymeric materials by the electronic industry
* Contributions by foremost experts in the field
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