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Polypropylene film is the most widely used dielectric material in HVDC capacitors. As the voltage level and transmission capacity of the power system increase, the dielectric properties of polypropylene film become more demanding. In recent years, researchers have studied the modification methods of polypropylene film to improve its breakdown field strength and energy storage density under operating conditions, and to reduce its dielectric loss.
This book comprehensively reports the relevant research on polypropylene film for HVDC capacitors. The book details the application background,
…mehr

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Produktbeschreibung
Polypropylene film is the most widely used dielectric material in HVDC capacitors. As the voltage level and transmission capacity of the power system increase, the dielectric properties of polypropylene film become more demanding. In recent years, researchers have studied the modification methods of polypropylene film to improve its breakdown field strength and energy storage density under operating conditions, and to reduce its dielectric loss.

This book comprehensively reports the relevant research on polypropylene film for HVDC capacitors. The book details the application background, fundamental properties and related theories of polypropylene dielectrics. The relationship between the microstructure and the dielectric properties of polypropylene films is described, and the insulation failure mechanism of polypropylene is discussed. The modification methods of polypropylene energy storage media including ash washing, molecular chain structure regulation, aggregation structure regulation, nanoparticle doping, polyphenyl ring compound modification, cycloolefin copolymer blending and interfacial molecular regulation are reviewed. The effects of high temperature and strong magnetic field on the dielectric properties of polypropylene films are discussed and the high temperature and strong magnetic field resistant polypropylene dielectrics are presented.

The book contains the dielectric constant, conductivity, breakdown field strength, energy storage density and other relevant graphs and data of modified polypropylene film under different operating conditions, which clearly explains the improvement effect of various modification methods on the dielectric properties of polypropylene film.

This book provides a comprehensive reference for the research of polypropylene film for HVDC capacitors. It can help students, researchers and technicians in related industries to understand the insulation failure mechanism of polypropylene film and make readers understand the latest modification methods to improve the dielectric performance of PP films.


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Autorenporträt
Boxue Du (M'00-SM'04) received the M.E. degree in electrical engineering from Ibaraki University and the Ph.D. degree from Tokyo University of A&T. During 1996 to 2002, he was with The Niigata Institute of Science and Technology, Japan and was an Associate Professor. From 2000 to 2002, he was a Visiting Scientist at Niigata University, Japan. Since 2002 he has been a Professor and Director-founder of the Institute of High Voltage at the School of Electrical and Information Engineering, Tianjin University, China. His research interests are focused on dielectric failure mechanisms of polymer insulating materials, polymer dielectrics for energy storage, electrical insulation technology and application of polymer dielectrics under various extreme environments. He has published 5 books and 25 book chapters in Polymer Dielectrics, and authored about 670 papers and over 200 of them published in IEEE Journals. He is an Editorial Boards Member of High Voltage, Journal of Electronics and Advanced Electrical Engineering, Journal of Modern Power Systems and Clear Energy, Chinese Journal of High Voltage Engineering, Insulation Materials and Electrical Engineering. He is a Fellow of IET, member at several WG in CIGRE and several Standards Committees in IEEE. He is an Associate Editor of IEEE Transactions on Industry Applications, a Subject Editor of IET Nanodielectrics, and was an Associate Editor of IEEE Transactions on Dielectrics and Electrical Insulation and IEEE Access.