Ali Jamnia

Practical Guide to the Packaging of Electronics (eBook, ePUB)

Thermal and Mechanical Design and Analysis, Third Edition

• Format: ePub

Produktbeschreibung

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides a basic understanding of electronics packaging design issues, updated to reflect recent developments in the field. Early chapters provide a foundation in heat transfer, vibration, and life expectancy calculations. Topics include modes of heat removal; impact of thermal stresses; vibration and stresses; shock management; mechanical, electrical, chemically induced reliability; and more.

---

Dieser Download kann aus rechtlichen Gründen nur mit Rechnungsadresse in A, B, BG, CY, CZ, D, DK, EW, E, FIN, F, GR, HR, H, IRL, I, LT, L, LR, M, NL, PL, P, R, S, SLO, SK ausgeliefert werden.

Produktdetails

• Verlag: Taylor & Francis
• Seitenzahl: 374
• Erscheinungstermin: 1. Dezember 2016
• Englisch
• ISBN-13: 9781315351087
• Artikelnr.: 47382929

Autorenporträt

Ali Jamnia enjoys teaching and mentoring junior engineers. His primary expertise lies in electromechanical systems design and development. In addition, he enjoys conducting analysis of various engineering problems using numerical approximations and computer simulations. Dr. Jamnia has focused on the issues of electronics packaging since the early 1990s, and since 1995, has been involved with the development of innovative electronics systems to aid individuals with either physical or cognitive disabilities. In fact, his prime achievement has been the development of a specialized computer system called the Learning StationTM - used as a teaching tool for individuals with cognitive disabilities.

Inhaltsangabe

Introduction. Basic Heat Transfer-Conduction, Convection, and Radiation.
Conductive Cooling. Radiation Cooling. Fundamentals of Convection Cooling.
Combined Modes, Transient Heat Transfer, and Advanced Materials. Basics of
Vibration and Its Isolation. Basics of Shock Management. Induced Stresses.
The Finite Element Methods. Mechanical and Thermomechanical Concerns.
Acoustics. Mechanical Failures and Reliability. Electrical Failures and
Reliability. Chemical Attack Failures and Reliability Concerns. Reliability
Models, Predictions, and Calculations. Design Considerations in an Avionics
Electronic Package.
Appendices. References.