Tetsuzo Yoshimura

Self-Organized 3D Integrated Optical Interconnects (eBook, PDF)

with All-Photolithographic Heterogeneous Integration

• Format: PDF

Produktbeschreibung

Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve "short line distances of the cm-mm order" and "large line counts of hundreds-thousands." This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules.

This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.

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Produktdetails

• Verlag: Taylor & Francis
• Seitenzahl: 380
• Erscheinungstermin: 8. März 2021
• Englisch
• ISBN-13: 9781000064605
• Artikelnr.: 60431387

Autorenporträt

Tetsuzo Yoshimura is currently a professor emeritus at Tokyo University of Technology.

Inhaltsangabe

1. Introduction 2. Guidelines toward Self
Organized 3D Integrated Optical Interconnects 3. Scalable Film Optical Link Modules (S
FOLMs) 4. Optical Waveguide Films with Vertical Mirrors and 3D Optical Circuits 5. Resource Saving All
Photolithographic Heterogeneous Integration: PL
Pack with SORT 6. High
Speed/Small
Size Light Modulators and Optical Switches 7. Self
Organized Lightwave Networks (SOLNETs) 8. Self
Organized 3D Integrated Optical Interconnects: Model Proposals 9. Self
Organized 3D Micro Optical Switching Systems (3D
MOSS): Model Proposals and Predicted Performance 10. Film
Based Integrated Solar Energy Conversion Systems 11. Embodiments Disclosed in Patents 12. Future Challenges