Andrea Chen, Randy Hsiao-Yu Lo

Semiconductor Packaging (eBook, PDF)

Materials Interaction and Reliability

• Format: PDF

Produktbeschreibung

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

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Produktdetails

• Verlag: Taylor & Francis
• Seitenzahl: 216
• Erscheinungstermin: 19. April 2016
• Englisch
• ISBN-13: 9781439862070
• Artikelnr.: 57532919

Autorenporträt

Andrea Chen is a technical marketing manager at Siliconware USA, Inc. She previously worked in the Technology Development group at ChipPAC, Inc. and in the Package Technology group at National Semiconductor Corporation. She has coauthored more than 30 papers and presentations.

Randy Hsiao-Yu Lo is president of Siliconware USA, Inc. He was previously the vice president of R&D at SPIL, leader of the Electronic Packaging Development group at ERSO/ITRI-Taiwan, and senior engineering manager of the Package Technology group at National Semiconductor Corporation. He has coauthored more than 20 papers and presentations and holds over 40 U.S. patents.

Inhaltsangabe

SEMICONDUCTOR PACKAGES: History and Background. Package Form Factors and
Families. Surface-Mount Technology. Other Packaging Needs. PACKAGE
RELIABILITY: Reliability Testing. MATERIALS USED IN SEMICONDUCTOR
PACKAGING: Polymers. Metals. Ceramics and Glasses. THE FUTURE: Trends and
Challenges. Light-Emitting Diodes. Appendices. Index.