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This book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.
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This book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.
Produktdetails
- Produktdetails
- Verlag: Springer Singapore
- Erscheinungstermin: 10. Mai 2019
- Englisch
- ISBN-13: 9789811380518
- Artikelnr.: 56840786
- Verlag: Springer Singapore
- Erscheinungstermin: 10. Mai 2019
- Englisch
- ISBN-13: 9789811380518
- Artikelnr.: 56840786
Ayan Karmakar received the B.Tech degree (Electronics and Communication) from Maulana Abul Kalam Azad University of Technology, West Bengal (formerly known as WBUT) in 2005. Later he did his masters from NIT, Durgapur. He joined ISRO as a ‘Scientist’ and subsequently posted to Semi-Conductor Laboratory (SCL), Chandigarh. His research interests include design and development of various passive microwave integrated circuits and antennas using silicon based MIC and RF-MEMS technology. His field of expertise are expanded in fabrication technology of various MEMS based sensors and evolving the test strategies for the same. He has numerous publications in reputed journals and conferences at various national and international levels. He received multiples prizes/awards from Department of Space for his active involvement and technical contributions in Rajbhasha (Hindi). He has shown keen interest to build a strong communication link between academics and industry. In this context,he has delivered numerous lectures in the invited talk series of various institutes of national importance. He serves as a reviewer in reputed referred journals. He is a Fellow of IETE and Life member of ISSE and Bangiya Bigyan Parishad, India. Dr. Kamaljeet Singh has obtained M. Tech (Microwaves) from Delhi University in 1999 and awarded PhD in 2010.He joined ISAC in 1999 and worked in the area of Geo- receiver at C-band. He was posted to Semi-conductor Laboratory, Near Chandigarh in 2006 where he was trained in thin film and worked in the area of RF-MEMS. He initiated development of various sensors along with re-establishment of 6”-MEMS Fabline at SCL and was principle investigator for NPMASS project. He is presently working in SEG group at URSC since 2016 and involved in development of C, S-band TT&C transponders along with X-band data transmitters for various missions. He is a fellow of IETE, Life member of ASI & Punjab Academy of Sciences and member ofIEEE. He has published more than 100 articles in various journals/conferences and is on the review board of many journals. He is the recipient of young scientist awards from INAE, IETE & ISRO. He published the book titled ‘RF principle and its application in RF-MEMS switch’. A patent titled liquid level sensor using MEMS technology is also filed.
Chapter 1: Silicon implementation of Planar Topologies.- Chapter-2: Fabrication technologies.- Chapter 3: Passive Circuits.- Chapter-4: Planar Antenna.- Chapter-5: MEMS Switch.- Chapter-6: Packaging concept in Radio Frequency.- Appendix-1: Material properties of some useful metals and dielectrics.- Appendix 2: Relaxation time estimation for some materials used in RF/microwave applications.- Appendix 3: Etch rate of various thin films of in wet and dry method.- Appendix 4: Readymade Chart for VSWR, Return Loss and Reflection Coefficient.
Chapter 1: Silicon implementation of Planar Topologies.- Chapter-2: Fabrication technologies.- Chapter 3: Passive Circuits.- Chapter-4: Planar Antenna.- Chapter-5: MEMS Switch.- Chapter-6: Packaging concept in Radio Frequency.- Appendix-1: Material properties of some useful metals and dielectrics.- Appendix 2: Relaxation time estimation for some materials used in RF/microwave applications.- Appendix 3: Etch rate of various thin films of in wet and dry method.- Appendix 4: Readymade Chart for VSWR, Return Loss and Reflection Coefficient.
Chapter 1: Silicon implementation of Planar Topologies.- Chapter-2: Fabrication technologies.- Chapter 3: Passive Circuits.- Chapter-4: Planar Antenna.- Chapter-5: MEMS Switch.- Chapter-6: Packaging concept in Radio Frequency.- Appendix-1: Material properties of some useful metals and dielectrics.- Appendix 2: Relaxation time estimation for some materials used in RF/microwave applications.- Appendix 3: Etch rate of various thin films of in wet and dry method.- Appendix 4: Readymade Chart for VSWR, Return Loss and Reflection Coefficient.
Chapter 1: Silicon implementation of Planar Topologies.- Chapter-2: Fabrication technologies.- Chapter 3: Passive Circuits.- Chapter-4: Planar Antenna.- Chapter-5: MEMS Switch.- Chapter-6: Packaging concept in Radio Frequency.- Appendix-1: Material properties of some useful metals and dielectrics.- Appendix 2: Relaxation time estimation for some materials used in RF/microwave applications.- Appendix 3: Etch rate of various thin films of in wet and dry method.- Appendix 4: Readymade Chart for VSWR, Return Loss and Reflection Coefficient.