Dieser Download kann aus rechtlichen Gründen nur mit Rechnungsadresse in A, B, BG, CY, CZ, D, DK, EW, E, FIN, F, GR, HR, H, IRL, I, LT, L, LR, M, NL, PL, P, R, S, SLO, SK ausgeliefert werden.
Die Herstellerinformationen sind derzeit nicht verfügbar.
Inhaltsangabe
Foreword; J.P. Mucha. Editors' Introduction; P. Nordholz, H. Grabinsky. Analysis of Frequency-Dependent Transmission Lines Using Rational Approximation and Recursive Convolution; W.T. Beyenne, J.E. Schutt-Ainé. Accurate Modeling of Interconnections for Timing Simulation of Sub-Micron Circuits; D. Deschacht, E. Vanier. Minimum Realization of Reduced-Order High-Speed Interconnect Macromodels; R. Achar, M. Nakhla. Lossy Interconnect Modeling for Transient Simulations; I. Maio, F. Canavero. Algorithms Supporting Driver/Receiver Design for Multi-Conductor Interconnects; O.A. Palusinski, et al. Prediction of PCB Susceptibility to Conducted Noise at Post Layout Level; D. Lasagna, et al. Experimental Validation of a Hybrid Method that Predicts Emissions Radiated by Printed Circuit Boards; E. Leroux, et al. Hybrid Time/Frequency-Domain Simulation of Transient Electromagnetic Coupling of Interconnects; A. Dietermann, et al. Simulation of Electromagnetic Wave Propagation on a Printed Circuit Board with Linear and Nonlinear Discrete Loads; M. Witting, T. Proepper. A Model for Ground Bounce Investigation in Structures with Conducting Planes; O. Kosch, et al. Influence of a Floating Plane on an Effective Ground Plane Inductance in Multilayer Packages; M. Lopez, et al. Analysis and Measurement of Crosstalk Induced Delay Errors in Integrated Circuits; F. Moll, et al.
Foreword; J.P. Mucha. Editors' Introduction; P. Nordholz, H. Grabinsky. Analysis of Frequency-Dependent Transmission Lines Using Rational Approximation and Recursive Convolution; W.T. Beyenne, J.E. Schutt-Ainé. Accurate Modeling of Interconnections for Timing Simulation of Sub-Micron Circuits; D. Deschacht, E. Vanier. Minimum Realization of Reduced-Order High-Speed Interconnect Macromodels; R. Achar, M. Nakhla. Lossy Interconnect Modeling for Transient Simulations; I. Maio, F. Canavero. Algorithms Supporting Driver/Receiver Design for Multi-Conductor Interconnects; O.A. Palusinski, et al. Prediction of PCB Susceptibility to Conducted Noise at Post Layout Level; D. Lasagna, et al. Experimental Validation of a Hybrid Method that Predicts Emissions Radiated by Printed Circuit Boards; E. Leroux, et al. Hybrid Time/Frequency-Domain Simulation of Transient Electromagnetic Coupling of Interconnects; A. Dietermann, et al. Simulation of Electromagnetic Wave Propagation on a Printed Circuit Board with Linear and Nonlinear Discrete Loads; M. Witting, T. Proepper. A Model for Ground Bounce Investigation in Structures with Conducting Planes; O. Kosch, et al. Influence of a Floating Plane on an Effective Ground Plane Inductance in Multilayer Packages; M. Lopez, et al. Analysis and Measurement of Crosstalk Induced Delay Errors in Integrated Circuits; F. Moll, et al.
Es gelten unsere Allgemeinen Geschäftsbedingungen: www.buecher.de/agb
Impressum
www.buecher.de ist ein Internetauftritt der buecher.de internetstores GmbH
Geschäftsführung: Monica Sawhney | Roland Kölbl | Günter Hilger
Sitz der Gesellschaft: Batheyer Straße 115 - 117, 58099 Hagen
Postanschrift: Bürgermeister-Wegele-Str. 12, 86167 Augsburg
Amtsgericht Hagen HRB 13257
Steuernummer: 321/5800/1497
USt-IdNr: DE450055826
