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Thermal Management Materials for Electronic Packaging Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering…mehr
Thermal Management Materials for Electronic Packaging
Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging
Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance.
The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area.
Sample topics covered in Thermal Management Materials for Electronic Packaging include:
Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids
Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials
Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure
Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation
Thermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.
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Autorenporträt
Xingyou Tian, Professor, is Deputy Director of Institute for Solid State Physics (ISSP), Hefei Institutes of Physical Science, Chinese Academy of Sciences and Director of the Key Laboratory of Photovoltaic and Energy-Saving Materials of the Chinese Academy of Sciences. His main research includes key functional materials for electronic devices, integrated circuit heat dissipation materials, polymer nanocomposite materials, and new energy-saving and environmentally friendly materials.
Inhaltsangabe
OVERVIEW OF WORKS
PHYSICAL BASIS OF THERMAL CONDUCTION Basic Concepts and Laws of Thermal Conduction Heat Conduction Differential Equation and Finite Solution Heat Conduction Mechanism and Theoretical Calculation Thermal Conductivity of Solids
ELECTRONIC PACKAGING MATERIALS FOR THERMAL MANAGEMENT Definition and Classification of Electronic Packaging Thermal Management in Electronic Equipment Require of Electronic Packaging Materials Electronic Packaging Materials
CHARACTERIZATION METHODS FOR THERMAL MANAGEMENT MATERIALS Overview of the Development of Thermal Conductivity Test Methods Test Method Classification and Standards Steady-State Method Non-Steady-State Method Electrical Properties and Measurement Techniques Material Characterization Analysis Technology Reliability Analysis and Environmental Performance Evaluation
CONSTRUCTION OF THERMAL CONDUCTIVITY NETWORK AND PERFORMANCE OPTIMIZATION OF POLYMER SUBSTRATE Synthesis and Surface Modification of High Thermal Conductive Filler and the Synthesis of Substrates Study on Polymer Thermal Conductive Composites with Oriented Structure Preparation of Thermal Conductive Composites with Inorganic Ceramic Skeleton Structure Assembly of Thermal Conductive Materials in Different Dimensions and Preparation of Composite Materials Conclusion
OPTIMAL DESIGN OF HIGH THERMAL CONDUCTIVE METAL SUBSTRATE SYSTEM FOR HIGH POWER DEVICES Power Devices and Thermal Conduction Optimization and Adaptability Design, Preparation and Modification of High Thermal Conductive Matrix and Components Formation and Evolution Rules of High Thermal Conductive Interface and its Control Method Formation and Evolution Rules of High Thermal Conductive Composite Microstructure and its Control Method
PREPARATION AND PERFORMANCE STUDY OF SILICON NITRIDE CERAMIC SUBSTRATE WITH HIGH THERMAL CONDUCTIVITY Rapid Nitridation of Silicon Compact and Tape Casting of Silicon Optimization of Sintering Aids for High Thermal Conductivity Si3N4 Ceramics Investigation of Cu-Metalized Si3N4 Substrates via Active Metal Brazing (AMB) Method
PREPARATION AND PROPERTIES OF THERMAL INTERFACE MATERIALS Conception of Thermal Interface Materials Polymer Based Thermal Interface Materials Metal Based Thermal Interface Materials Carbon Based Thermal Interface Materials Molecular Simulation Study of Interfacial Thermal Transfer
STUDY ON SIMULATION OF THERMAL CONDUCTIVE COMPOSITE FILLING THEORY Molecular Simulation Algorithms for Thermal Conductivity Calculating Molecular Simulation Study on Polymers Molecular Simulation Study on TC of Si3N4 Ceramics Molecular Simulation Study on TC of Diamond/Copper Composites Simulation Study on Polymer-Based Composites
MARKET AND FUTURE PROSPECTS OF HIGH THERMAL CONDUCTIVITY COMPOSITE MATERIALS Basic Concept of Composite Materials Thermal Conductivity Mechanism and Thermal Conductivity Model Composite Materials in Electronic Devices Thermal Functional Composites The Modification of Composite Materials The New Packaging Material Thermal Management of Electronic Devices Methods for Improving Thermal Conductivity of Composite Materials The Application of Composite Materials Conclusions
PHYSICAL BASIS OF THERMAL CONDUCTION Basic Concepts and Laws of Thermal Conduction Heat Conduction Differential Equation and Finite Solution Heat Conduction Mechanism and Theoretical Calculation Thermal Conductivity of Solids
ELECTRONIC PACKAGING MATERIALS FOR THERMAL MANAGEMENT Definition and Classification of Electronic Packaging Thermal Management in Electronic Equipment Require of Electronic Packaging Materials Electronic Packaging Materials
CHARACTERIZATION METHODS FOR THERMAL MANAGEMENT MATERIALS Overview of the Development of Thermal Conductivity Test Methods Test Method Classification and Standards Steady-State Method Non-Steady-State Method Electrical Properties and Measurement Techniques Material Characterization Analysis Technology Reliability Analysis and Environmental Performance Evaluation
CONSTRUCTION OF THERMAL CONDUCTIVITY NETWORK AND PERFORMANCE OPTIMIZATION OF POLYMER SUBSTRATE Synthesis and Surface Modification of High Thermal Conductive Filler and the Synthesis of Substrates Study on Polymer Thermal Conductive Composites with Oriented Structure Preparation of Thermal Conductive Composites with Inorganic Ceramic Skeleton Structure Assembly of Thermal Conductive Materials in Different Dimensions and Preparation of Composite Materials Conclusion
OPTIMAL DESIGN OF HIGH THERMAL CONDUCTIVE METAL SUBSTRATE SYSTEM FOR HIGH POWER DEVICES Power Devices and Thermal Conduction Optimization and Adaptability Design, Preparation and Modification of High Thermal Conductive Matrix and Components Formation and Evolution Rules of High Thermal Conductive Interface and its Control Method Formation and Evolution Rules of High Thermal Conductive Composite Microstructure and its Control Method
PREPARATION AND PERFORMANCE STUDY OF SILICON NITRIDE CERAMIC SUBSTRATE WITH HIGH THERMAL CONDUCTIVITY Rapid Nitridation of Silicon Compact and Tape Casting of Silicon Optimization of Sintering Aids for High Thermal Conductivity Si3N4 Ceramics Investigation of Cu-Metalized Si3N4 Substrates via Active Metal Brazing (AMB) Method
PREPARATION AND PROPERTIES OF THERMAL INTERFACE MATERIALS Conception of Thermal Interface Materials Polymer Based Thermal Interface Materials Metal Based Thermal Interface Materials Carbon Based Thermal Interface Materials Molecular Simulation Study of Interfacial Thermal Transfer
STUDY ON SIMULATION OF THERMAL CONDUCTIVE COMPOSITE FILLING THEORY Molecular Simulation Algorithms for Thermal Conductivity Calculating Molecular Simulation Study on Polymers Molecular Simulation Study on TC of Si3N4 Ceramics Molecular Simulation Study on TC of Diamond/Copper Composites Simulation Study on Polymer-Based Composites
MARKET AND FUTURE PROSPECTS OF HIGH THERMAL CONDUCTIVITY COMPOSITE MATERIALS Basic Concept of Composite Materials Thermal Conductivity Mechanism and Thermal Conductivity Model Composite Materials in Electronic Devices Thermal Functional Composites The Modification of Composite Materials The New Packaging Material Thermal Management of Electronic Devices Methods for Improving Thermal Conductivity of Composite Materials The Application of Composite Materials Conclusions
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