Vasilis F. Pavlidis, Eby G. Friedman

Three-dimensional Integrated Circuit Design (eBook, ePUB)

• Format: ePub

Produktbeschreibung

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future.

This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits.

* Demonstrates how to overcome "interconnect bottleneck" with 3-D integrated circuit design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers
* The FIRST book on 3-D integrated circuit design...provides up-to-date information that is otherwise difficult to find
* Focuses on design issues key to the product development cycle...good design plays a major role in exploiting the implementation flexibilities offered in the 3-D
* Provides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization...offers practical view of designing 3-D circuits

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Produktdetails

• Verlag: Elsevier Science & Techn.
• Seitenzahl: 336
• Erscheinungstermin: 28. Juli 2010
• Englisch
• ISBN-13: 9780080921860
• Artikelnr.: 38123714

Autorenporträt

Vasilis F. Pavlidis received the B.Sc. and M.Eng. degrees in Electrical and Computer Engineering from the Democritus University of Thrace, Greece, in 2000 and 2002, respectively. He received the M.Sc. and Ph.D. degrees in Electrical and Computer Engineering from the University of Rochester, Rochester, NY, in 2003 and 2008, respectively.

He is currently an Assistant Professor in the School of Computer Science at the University of Manchester, Manchester, UK. From 2008 to 2012, he was a post-doctoral fellow with the Integrated Systems Laboratory at the Ecole Polytechnique Fédérale de Lausanne, Lausanne, Switzerland. He was with INTRACOM S.A., Athens, Greece, from 2000 to 2002. He has also been a visiting researcher at Synopsys Inc., Mountain View, CA, with the Primetime group in 2007. His current research interests include interconnect modeling and analysis, 3-D and 2.5-D integration, and other issues related to VLSI design. He has published several conference and journal papers in these areas. He was the leading designer of the Rochester cube and co-creator of the Manchester Thermal Analyzer.

Dr. Pavlidis is on the editorial board of the Microelectronics Journal and Integration, the VLSI Journal. He also serves on the Technical Program Committees of several IEEE conferences. He is a member of the VLSI Systems & Applications Technical Committee of the Circuits and Systems Society and a member of the IEEE. He is also involved in public policy issues as a member of the ICT working group of the IEEE European Public Policy Initiative.

Inhaltsangabe

Chapter 1. Introduction
Chapter 2. Manufacturing of 3-D Packaged Systems
Chapter 3. 3-D Integrated Circuit Fabrication Technologies
Chapter 4. Interconnect Prediction Models
Chapter 5. Physical Design Techniques for 3-D ICs
Chapter 6. Thermal Management Techniques
Chapter 7. Timing Optimization for Two-Terminal Interconnects
Chapter 8. Timing Optimization for Multi-Terminal Interconnects
Appendix A: Enumeration of Gate Pairs in a 3-D IC
Appendix B: Formal Proof of Optimum Single Via Placement
Appendix C: Proof of the Two-Terminal Via Placement Heuristic
Appendix D: Proof of Condition for Via Placement of Multi-Terminal Nets
References