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The book presents a complete overview on the topic of Transient Liquid Phase Bonding (TLPB) which has many high-tech applications, ranging from the production and repair of turbine engines in the aerospace industry, to nuclear power plants and the connection of circuit lines in the microelectronics industry. Keywords: Liquid Phase Bonding, Athermal Solidification, Isothermal Solidification, Melting-point Depressant, Intermetallics, Superalloys, Self-Bonding of Pure Materials, Self-Bonding of Composites, Self-Bonding of Alloys, Bonding Different-Base Alloys, Bonding Ceramics to Ceramics, Bonding Ceramics to Metals.
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