Shenglin Ma, Yufeng Jin

TSV 3D RF Integration (eBook, ePUB)

High Resistivity Si Interposer Technology

• Format: ePub

Produktbeschreibung

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters.

A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology.

• Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology
• Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods
• Offers a systematic and comparative literature review of HR-Si interposer technology by topic
• Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems
• Gives a systematic and accessible accounting on this leading technology

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Produktdetails

• Verlag: Elsevier Science & Techn.
• Seitenzahl: 292
• Erscheinungstermin: 27. April 2022
• Englisch
• ISBN-13: 9780323996037
• Artikelnr.: 63911135

Autorenporträt

Shenglin Ma is Associate Professor in the Department of Mechanical and Electrical Engineering at Xiamen University, China. He received his PhD from Peking University and has also been a guest researcher with the National Key Laboratory of Science and Technology in Micro/Nano Fabrication at Peking University. He has over 50 publications and 20 patents to his name, and his research focuses on TSV based 3D integration technology, MEMS and its applications.