Suchergebnisse für ""John H. Lau""
21 Artikel gefunden
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Cover Solder Joint Reliability (eBook, PDF)
John H. Lau 
Solder Joint Reliability (eBook, PDF)
eBook

161,95 €
Cover Chiplet Design and Heterogeneous Integration Packaging
John H. Lau 
Chiplet Design and Heterogeneous …
Buch

97,99 €
Cover Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau 
Flip Chip, Hybrid Bonding, Fan-In, and …
Buch

90,99 €
Cover Chiplet Design and Heterogeneous Integration Packaging
John H. Lau 
Chiplet Design and Heterogeneous …
Buch

134,99 €
Cover Semiconductor Advanced Packaging
John H. Lau 
Semiconductor Advanced Packaging
Buch

82,99 €
Cover Semiconductor Advanced Packaging
John H. Lau 
Semiconductor Advanced Packaging
Buch

119,99 €
Cover Fan-Out Wafer-Level Packaging
John H. Lau 
Fan-Out Wafer-Level Packaging
Buch

82,99 €
Cover Heterogeneous Integrations
John H. Lau 
Heterogeneous Integrations
Buch

119,99 €
Cover Fan-Out Wafer-Level Packaging
John H. Lau 
Fan-Out Wafer-Level Packaging
Buch

112,99 €
Cover Solder Joint Reliability
John H. Lau 
Solder Joint Reliability
Buch

153,99 €
Cover Assembly and Reliability of Lead-Free Solder Joints
John H. Lau, …
Assembly and Reliability of Lead-Free …
Buch

86,99 €
Cover Assembly and Reliability of Lead-Free Solder Joints
John H. Lau, …
Assembly and Reliability of Lead-Free …
Buch

120,99 €
Cover Handbook Of Tape Automated Bonding
John H. Lau 
Handbook Of Tape Automated Bonding
Buch

153,99 €
Cover Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology (eBook, PDF)
John H. Lau 
Flip Chip, Hybrid Bonding, Fan-In, and …
eBook

137,95 €
Cover Chiplet Design and Heterogeneous Integration Packaging (eBook, PDF)
John H. Lau 
Chiplet Design and Heterogeneous …
eBook

97,95 €
Cover Semiconductor Advanced Packaging (eBook, PDF)
John H. Lau 
Semiconductor Advanced Packaging …
eBook

81,95 €
Cover Heterogeneous Integrations (eBook, PDF)
John H. Lau 
Heterogeneous Integrations (eBook, PDF)
eBook

121,95 €
Cover Fan-Out Wafer-Level Packaging (eBook, PDF)
John H. Lau 
Fan-Out Wafer-Level Packaging (eBook, PDF)
eBook

81,95 €
Cover Assembly and Reliability of Lead-Free Solder Joints (eBook, PDF)
John H. Lau, …
Assembly and Reliability of Lead-Free …
eBook

89,95 €
Cover Flip Chip Technologies (Electronic Packaging and Interconnection Series)
John H. Lau 
Flip Chip Technologies (Electronic …
Buch

0,00 €
Cover Contemporary Masters in Criminology
Joan McCord (ed.) / …
Contemporary Masters in Criminology
Buch

115,99 €


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