Failure-Free Integrated Circuit Packages - Cohn, Charles; Harper, Charles A
123,99 €
inkl. MwSt.
Versandkostenfrei*
Versandfertig in über 4 Wochen
  • Gebundenes Buch

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. SPOT, STOP, AND ANALYZE IC DEVICE FAILURE WITH THIS UNIQUE ILLUSTRATED GUIDE Worth more than a thousand words, each illustration in Failure- Free Integrated Circuit Packages gives you a visual reference on common failure modes of IC devices in organic packages. In addition, the wide knowledge base of the chapter authors provides you with proven, leading-edge failure analysis techniques. Failure-Free…mehr

Andere Kunden interessierten sich auch für
Produktbeschreibung
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. SPOT, STOP, AND ANALYZE IC DEVICE FAILURE WITH THIS UNIQUE ILLUSTRATED GUIDE Worth more than a thousand words, each illustration in Failure- Free Integrated Circuit Packages gives you a visual reference on common failure modes of IC devices in organic packages. In addition, the wide knowledge base of the chapter authors provides you with proven, leading-edge failure analysis techniques. Failure-Free Integrated Circuit Packages helps you: * Find, identify, and correct potential failures before they occur * Improve device reliability * Learn from case studies of IC package failure modes * Quickly locate failures through visual comparisons * Apply state-of-the-art failure analysis techniques * Comprehend the physics behind the failure mechanism * Understand the limitations of reliability testing and lifetime estimation INSIDE, YOU'LL FIND A PRACTICAL AND EASY WAY TO APPROACH FAILURE ANALYSIS OF ICs IN ORGANIC PACKAGES. AREAS COVERED INCLUDE: Fundamentals of IC package technologies Reliability Physics and chemistry of failures in packaged devices Strategies for locating failures Failure analysis techniques Failure modes common in organic IC packages Emerging assembly materials for IC packaging
Autorenporträt
Charles Cohn is a Distinguished Member of Technical Staff in the IC Packaging and Interconnection Organization at Agere Systems. He has been with AT&T /Lucent/Agere for 21 years, and is currently lead technologist for Agere's operations in this field. He has conducts many seminars in advanced IC packaging and interconnection, the U.S. and overseas, and has been awarded ten US patents