Cheryl Tulkoff, Greg Caswell

Design for Excellence C

• Gebundenes Buch

Produktbeschreibung

DESIGN FOR EXCELLENCE IN ELECTRONICS MANUFACTURING

An authoritative guide to optimizing design for manufacturability and reliability from a team of experts

Design for Excellence in Electronics Manufacturing is a comprehensive, state-of-the-art book that covers design and reliability of electronics. The authors--noted experts on the topic--explain how using the DfX concepts of design for reliability, design for manufacturability, design for environment, design for testability, and more, reduce research and development costs and decrease time to market and allow companies to confidently issue warranty coverage.

By employing the concepts outlined in Design for Excellence in Electronics Manufacturing, engineers and managers can increase customer satisfaction, market share, and long-term profits. In addition, the authors describe the best practices regarding product design and show how the practices can be adapted for different manufacturing processes, suppliers, use environments, and reliability expectations. This important book:
_ Contains a comprehensive review of the design and reliability of electronics
_ Covers a range of topics: establishing a reliability program, design for the use environment, design for manufacturability, and more
_ Includes technical information on electronic packaging, discrete components, and assembly processes
_ Shows how aspects of electronics can fail under different environmental stresses

Written for reliability engineers, electronics engineers, design engineers, component engineers, and others, Design for Excellence in Electronics Manufacturing is a comprehensive book that reveals how to get product design right the first time.

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Produktdetails

• Wiley Series in Quality and Reliability Engineering
• Verlag: Wiley / Wiley & Sons
• Artikelnr. des Verlages: 1W119109370
• 1. Auflage
• Seitenzahl: 400
• Erscheinungstermin: 29. März 2021
• Englisch
• Abmessung: 216mm x 140mm x 22mm
• Gewicht: 626g
• ISBN-13: 9781119109372
• ISBN-10: 111910937X
• Artikelnr.: 59336440

Autorenporträt

CHERYL TULKOFF is Director of Corporate Quality at National Instruments, Texas, USA. She has over 22 years of experience in electronics manufacturing focusing on failure analysis and reliability. She's passionate about accelerating product design and development while improving reliability, optimizing resources, and improving customer satisfaction. GREG CASWELL is a Senior Member of the Technical Staff, DfR Solutions. He has over 50 years of experience in the microelectronics industry. His experience encompasses all aspects of SMT manufacturing, circuit board fabrication, advanced packaging, IC fabrication processes and materials, solder reflow, and RoHS.

Inhaltsangabe

Contributors xxiii

Foreword xxv

Preface xxvii

Acknowledgments xxix

Acronyms xxxi

Introduction iii

1 Introduction to Design for Excellence

1.1 Design for Excellence (DfX) in Electronics Manufacturing 1

1.2 Chapter 2 - Establishing a Reliability Program 3

1.3 Chapter 3 - Design for Reliability (DfR) 3

1.4 Chapter 4 - Design for the Use Environment: Reliability Testing

and Test Plan Development 4

1.5 Chapter 5 - Design for Manufacturability 5

1.6 Chapter 6 - Design for Life Cycle Management 6

1.7 Chapter 7 - Root Cause Problem-Solving, Failure Analysis, and Continual Improvement Techniques 1.8 Chapter 8 - Summary and Bringing It All Together 8

2 Establishing a Reliability Program

2.1 Introduction 9

2.2 Best Practices and the Economics of a Reliability Program 12

2.2.1 Best in Class Reliability Program Practices 13

2.3 Elements of a Reliability Program 16

2.3.1 Reliability Goals 17

2.3.2 Defined Use Environments 18

2.3.3 Software Reliability 21

2.3.4 General Software Requirements 22

2.4 Review of Commonly Used Probability and Statistics Concepts in Reliability

2.4.1 Sources of Reliability Data 32

2.4.2 Reliability Probability in Electronics 35

2.4.3 Variation Statistics 35

2.4.4 Reliability Statistics in Electronics 36

2.5 Reliability Analysis and Prediction Methods 39

2.6 Summary 45

Bibliography 45

3 Design for Reliability

3.1 Introduction 47

3.1.1 DfR at the Concept Stage 54

3.2 Specifications (Product and Environment Definitions and Con

cerns) 57

3.3 Reliability Physics Analysis 61

3.3.1 Reliability Physics Alternatives 68

3.3.2 Reliability Physics Models and Examples 71

3.3.3 Component Selection 77

3.3.4 Critical Components 79

3.3.5 Moisture Sensitivity Level 81

3.3.6 Temperature Sensitivity Level 81

3.3.7 Electrostatic Discharge 81

3.3.8 Lifetime 83

3.4 Surviving the Heat Wave 85

3.5 Redundancy 89

3.6 Plating Materials - Tin Whiskers 91

3.7 Derating and Uprating 94

3.8 Reliability of New Packaging Technologies 96

3.9 Printed Circuit Boards 98

3.9.1 Surface Finishes 99

3.9.2 Laminate Selection 107

3.9.3 Cracking and Delamination 108

3.9.4 Plated Through Holes- Vias 109

3.9.5 Conductive Anodic Filament 112

3.9.6 Strain and Flexure Issues 116

3.9.7 Pad Cratering 119

3.9.8 PCB Buckling 120

3.9.9 Electrochemical Migration 121

3.9.10 Cleanliness 134

3.10 Non-Functional Pads 138

3.11 Wearout Mechanisms 139

3.12 Conformal Coating and Potting 143

Bibliography 150

4 Design for the Use Environment: Reliability Testing and Test

Plan Development

4.1 Introduction 155

4.1.1 Elements of a Testing Program 157

4.1.2 Know The Environment 162

4.2 Standards and Measurements 164

4.3 Failure Inducing Stressors 165

4.4 Common Test Types 166

4.4.1 Temperature Cycling 166

4.4.2 Temperature-Humidity-Bias Testing 168

4.4.3 Electrical Connection 169

4.4.4 Corrosion Tests 169

4.4.5 Power Cycling 170

4.4.6 Electrical Loads 170

4.4.7 Mechanical Bending 171

4.4.8 Random and Sinusoidal Vibration 172

4.4.9 Mechanic