Gordon N Ellison
Thermal Computations for Electronics
Conductive, Radiative, and Convective Air Cooling
Gordon N Ellison
Thermal Computations for Electronics
Conductive, Radiative, and Convective Air Cooling
- Broschiertes Buch
- Merkliste
- Auf die Merkliste
- Bewerten Bewerten
- Teilen
- Produkt teilen
- Produkterinnerung
- Produkterinnerung
The flavor and organization of the first edition has been retained whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer.
Andere Kunden interessierten sich auch für
- Practical Guide to the Packaging of Electronics69,99 €
- William S JannaDesign of Fluid Thermal Systems230,99 €
- Novel Advances in Microsystems Technologies and Their Applications110,99 €
- John G WebsterMechanical Variables Measurement - Solid, Fluid, and Thermal90,99 €
- Alexander V DimitrovIntroduction to Energy Technologies for Efficient Power Generation67,99 €
- Yukio YanagisawaChemical Sensitivity and Sick-Building Syndrome69,99 €
- J. Paul GuyerAn Introduction to Site Screening for In Situ Thermal Remediation of Contaminated Soil31,99 €
-
-
-
The flavor and organization of the first edition has been retained whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer.
Produktdetails
- Produktdetails
- Verlag: CRC Press
- 2nd edition
- Seitenzahl: 404
- Erscheinungstermin: 13. Juni 2022
- Englisch
- Abmessung: 251mm x 175mm x 25mm
- Gewicht: 703g
- ISBN-13: 9781032336312
- ISBN-10: 1032336315
- Artikelnr.: 69896891
- Verlag: CRC Press
- 2nd edition
- Seitenzahl: 404
- Erscheinungstermin: 13. Juni 2022
- Englisch
- Abmessung: 251mm x 175mm x 25mm
- Gewicht: 703g
- ISBN-13: 9781032336312
- ISBN-10: 1032336315
- Artikelnr.: 69896891
Gordon N. Ellison has a BA in Physics from the University of California at Los Angeles (UCLA) and an MA in Physics from the University of Southern California (USC). His career in thermal engineering includes twelve years as a Technical Specialist at NCR and eighteen years at Tektronix, Inc., retiring from the latter as a Tektronix Fellow. Over the last fifteen years Ellison has been an independent consultant and has also taught the course, Thermal Analysis for Electronics, at Portland State University, Oregon. He has also designed and written several thermal analysis computer codes.
Introduction. Thermodynamics of airflow. Airflow I: Forced flow in systems.
Airflow II: Forced flow in ducts, extrusions, and pin fin arrays. Airflow
III: Buoyancy driven draft. Forced convective heat transfer I: Components.
Forced convective heat transfer II: Ducts, extrusions, and pin fin arrays.
Natural convection heat transfer I: Plates. Natural convection heat
transfer II: Heat sinks. Thermal radiation heat transfer. Conduction I:
Basics. Conduction II: Spreading resistance. Additional mathematical
methods. Appendix i: Physical properties of dry air at atmospheric
pressure. Appendix ii: Radiation emissivity at room temperature. Appendix
iii: Thermal conductivity of some common electronic packaging materials.
Appendix iv: Some properties of Bessel functions. Appendix v: Some
properties of the Dirac delta function. Appendix vi: Fourier coefficients
for a rectangular source. Appendix vii: Derivation of the Green's function
properties for the spreading problem of a rectangular source and substrate
- method A. Appendix viii: Derivation of the Green's function properties
for the spreading problem of a rectangular source and substrate - method B.
Appendix ix: Proof of reciprocity for the steady-state Green's function.
Proof of reciprocity for the three-dimensional, time-dependent Green's
function. Appendix x: Finned surface to flat plate h conversion. Appendix
xi: Some conversion factors. Appendix xii: Altitude effects for fan driven
airflow and forced convection cooled enclosures.Appendix xiii: Altitude
effects for buoyancy driven airflow and natural convection cooled
enclosures. Bibliography. Index.
Airflow II: Forced flow in ducts, extrusions, and pin fin arrays. Airflow
III: Buoyancy driven draft. Forced convective heat transfer I: Components.
Forced convective heat transfer II: Ducts, extrusions, and pin fin arrays.
Natural convection heat transfer I: Plates. Natural convection heat
transfer II: Heat sinks. Thermal radiation heat transfer. Conduction I:
Basics. Conduction II: Spreading resistance. Additional mathematical
methods. Appendix i: Physical properties of dry air at atmospheric
pressure. Appendix ii: Radiation emissivity at room temperature. Appendix
iii: Thermal conductivity of some common electronic packaging materials.
Appendix iv: Some properties of Bessel functions. Appendix v: Some
properties of the Dirac delta function. Appendix vi: Fourier coefficients
for a rectangular source. Appendix vii: Derivation of the Green's function
properties for the spreading problem of a rectangular source and substrate
- method A. Appendix viii: Derivation of the Green's function properties
for the spreading problem of a rectangular source and substrate - method B.
Appendix ix: Proof of reciprocity for the steady-state Green's function.
Proof of reciprocity for the three-dimensional, time-dependent Green's
function. Appendix x: Finned surface to flat plate h conversion. Appendix
xi: Some conversion factors. Appendix xii: Altitude effects for fan driven
airflow and forced convection cooled enclosures.Appendix xiii: Altitude
effects for buoyancy driven airflow and natural convection cooled
enclosures. Bibliography. Index.
Introduction. Thermodynamics of airflow. Airflow I: Forced flow in systems.
Airflow II: Forced flow in ducts, extrusions, and pin fin arrays. Airflow
III: Buoyancy driven draft. Forced convective heat transfer I: Components.
Forced convective heat transfer II: Ducts, extrusions, and pin fin arrays.
Natural convection heat transfer I: Plates. Natural convection heat
transfer II: Heat sinks. Thermal radiation heat transfer. Conduction I:
Basics. Conduction II: Spreading resistance. Additional mathematical
methods. Appendix i: Physical properties of dry air at atmospheric
pressure. Appendix ii: Radiation emissivity at room temperature. Appendix
iii: Thermal conductivity of some common electronic packaging materials.
Appendix iv: Some properties of Bessel functions. Appendix v: Some
properties of the Dirac delta function. Appendix vi: Fourier coefficients
for a rectangular source. Appendix vii: Derivation of the Green's function
properties for the spreading problem of a rectangular source and substrate
- method A. Appendix viii: Derivation of the Green's function properties
for the spreading problem of a rectangular source and substrate - method B.
Appendix ix: Proof of reciprocity for the steady-state Green's function.
Proof of reciprocity for the three-dimensional, time-dependent Green's
function. Appendix x: Finned surface to flat plate h conversion. Appendix
xi: Some conversion factors. Appendix xii: Altitude effects for fan driven
airflow and forced convection cooled enclosures.Appendix xiii: Altitude
effects for buoyancy driven airflow and natural convection cooled
enclosures. Bibliography. Index.
Airflow II: Forced flow in ducts, extrusions, and pin fin arrays. Airflow
III: Buoyancy driven draft. Forced convective heat transfer I: Components.
Forced convective heat transfer II: Ducts, extrusions, and pin fin arrays.
Natural convection heat transfer I: Plates. Natural convection heat
transfer II: Heat sinks. Thermal radiation heat transfer. Conduction I:
Basics. Conduction II: Spreading resistance. Additional mathematical
methods. Appendix i: Physical properties of dry air at atmospheric
pressure. Appendix ii: Radiation emissivity at room temperature. Appendix
iii: Thermal conductivity of some common electronic packaging materials.
Appendix iv: Some properties of Bessel functions. Appendix v: Some
properties of the Dirac delta function. Appendix vi: Fourier coefficients
for a rectangular source. Appendix vii: Derivation of the Green's function
properties for the spreading problem of a rectangular source and substrate
- method A. Appendix viii: Derivation of the Green's function properties
for the spreading problem of a rectangular source and substrate - method B.
Appendix ix: Proof of reciprocity for the steady-state Green's function.
Proof of reciprocity for the three-dimensional, time-dependent Green's
function. Appendix x: Finned surface to flat plate h conversion. Appendix
xi: Some conversion factors. Appendix xii: Altitude effects for fan driven
airflow and forced convection cooled enclosures.Appendix xiii: Altitude
effects for buoyancy driven airflow and natural convection cooled
enclosures. Bibliography. Index.