
Broschiertes Buch
4. Oktober 2024
CRC Press
Gebundenes Buch | 210,99 € | |
eBook, ePUB | 59,95 € | |
eBook, PDF | 59,95 € |

Broschiertes Buch
Probabilistic Modeling of an Aerospace Mission Outcome
31. März 2021
CRC Press
Gebundenes Buch | 220,99 € | |
eBook, ePUB | 48,95 € | |
eBook, PDF | 48,95 € |

Gebundenes Buch
28. Januar 2021
CRC Press

Gebundenes Buch
Probabilistic Modeling of an Aerospace Mission Outcome
5. April 2018
CRC Press

Broschiertes Buch
Volume I Basic Principles of Engineering Elastictiy and Fundamentals of Structural Analysis
Softcover reprint of the original 1st ed. 1991
17. Februar 2012
Springer / Springer Netherlands
978-94-011-6537-2
eBook, PDF | 40,95 € |

Gebundenes Buch
Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
2007
29. Mai 2007
Springer / Springer US / Springer, Berlin
11055464,978-0-387-27974-9
eBook, PDF | 395,95 € |

eBook, ePUB
27. Januar 2021
Taylor & Francis eBooks

eBook, PDF
27. Januar 2021
Taylor & Francis eBooks



eBook, PDF
6. Dezember 2012
Springer Netherlands
Ähnlichkeitssuche: Fact®Finder von OMIKRON