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Gebundenes Buch
3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
1. Auflage
10. April 2012
Wiley & Sons
eBook, ePUB | 111,99 € | |
eBook, PDF | 111,99 € |
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7. April 2014
Cambridge University Press
eBook, ePUB | 44,95 € | |
eBook, PDF | 60,95 € |
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eBook, ePUB
13. Februar 2014
Cambridge University Press
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eBook, PDF
13. Februar 2014
Cambridge University Press
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eBook, PDF
19. März 2012
John Wiley & Sons
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eBook, ePUB
19. März 2012
John Wiley & Sons
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Gebundenes Buch
2. Februar 2025
Springer / Springer Nature Switzerland / Springer, Berlin
978-3-031-75785-3
eBook, PDF | 145,95 € |
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eBook, PDF
1. Februar 2025
Springer Nature Switzerland
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