Clyde Coombs, Happy Holden

Printed Circuits Handbook, Seventh Edition

• Gebundenes Buch

Produktbeschreibung

The world's leading guide to printed circuitsâ completely updated to include the latest tools, technology, and techniques

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Produktdetails

• Verlag: McGraw-Hill Education - Europe
• 7 ed
• Seitenzahl: 1648
• Erscheinungstermin: 9. März 2016
• Englisch
• Abmessung: 241mm x 187mm x 63mm
• Gewicht: 2638g
• ISBN-13: 9780071833950
• ISBN-10: 0071833951
• Artikelnr.: 43156463

Autorenporträt

Clyde F. Coombs, Jr, (Los Altos, CA) recently retired from Hewlett-Packard. He is the editor of all five editions of the Printed Circuits Handbook, the first of which was published in 1967. He is also the editor of two editions of the Electronics Instrument Handbook and the communications Network Test and Measurement Handbook.

Inhaltsangabe

Part 1: Printed Circuit Technology Drivers
Chapter 1. Electronic Packaging and High-Density Interconnectivity Clyde F.
Coombs, Jr., and Happy T. Holden 3
1.1 Introduction / 3
1.2 Measuring the Interconnectivity Revolution / 3
1.3 Hierarchy of Interconnections / 6
1.4 Factors Affecting Selection of Interconnections / 7
1.5 ICs and Packages / 9
1.6 Density Evaluations / 10
1.7 Methods to Increase PWB Density / 13
1.8 References / 18
Chapter 2. Types of Printed Wiring Boards Hayao Nakahara 19
2.1 Introduction / 19
2.2 Classification of Printed Wiring Boards / 19
2.3 Organic and Nonorganic Substrates / 21
2.4 Graphical and Discrete-Wire Boards / 21
2.5 Rigid and Flexible Boards / 22
2.6 Graphically Produced Boards / 22
2.7 Molded Interconnection Devices / 27
2.8 Plated-Through-Hole Technologies / 27
2.9 Summary / 30
2.10 References / 30
Part 2: Managing the Printed Circuit Supply Chain
Chapter 3. Basics of Printed Circuit Supply Chain Management Tim Rodgers
33
3.1 Introduction / 33
3.2 General Business Considerations / 34
3.3 Contract Manufacturers / 35
3.4 Criteria for Evaluating Suppliers / 35
3.5 Supplier Selection Criteria Example / 41
Chapter 4. Design for Manufacturability Tim Rodgers 43
4.1 General Principles / 43
4.2 PCB/PCA Pricing Models / 44
4.3 Process Cost Drivers / 49
4.4 Production Yield and Design for Manufacturability / 51
4.5 DFM Complexity Models / 59
Chapter 5. Manufacturing Information, Documentation, Formatting, and
Exchange Happy T. Holden 63
5.1 Introduction / 63
5.2 Manufacturing Information / 64
5.3 Fabrication Information Exchange / 68
5.4 Data Exchange Formats / 73
5.5 Initial Design Review / 86
5.6 Design Input / 94
5.7 Design Analysis and Review / 99
5.8 Acknowledgments / 99
5.9 References / 100
Chapter 6. Supplier Selection and Qualification Tim Rodgers 101
6.1 Introduction / 101
6.2 Evaluating Suppliers / 102
6.3 Supplier Selection / 113
6.4 Supplier Qualification / 114
Chapter 7. Process Control, Monitoring, and Incoming Inspection Tim Rodgers
117
7.1 Introduction / 117
7.2 Process Capability and Process Control / 117
7.3 Process Monitoring and Troubleshooting / 122
7.4 Assessing a PCB Fabricators Capability / 122
7.5 Testing and Inspection / 156
7.6 Incoming Inspection / 158
Chapter 8. Product Acceptance and Feedback Tim Rodgers 159
8.1 Introduction / 159
8.2 Design Qualification / 159
8.3 Incoming Inspection and Lot Acceptance / 160
8.4 Supplier Performance Management / 162
8.5 Business Reviews / 165
8.6 Strategic Supplier Management / 167
Part 3: Materials
Chapter 9. Introduction to Base Materials Edward Kelley and Douglas
Trobough 171
9.1 Introduction / 171
9.2 Grades and Specifications / 171
9.3 Properties Used to Classify Base Materials / 178
9.4 Types of FR-4 / 184
9.5 Laminate Identification Scheme / 185
9.6 Prepreg Identification Scheme / 186
9.7 Laminate and Prepreg Manufacturing Processes / 189
9.8 References / 195
Chapter 10. Base Material Components Edward Kelley and Douglas Trobough 197
10.1 Introduction / 197
10.2 Other Resin Systems / 201
10.3 Legislative Issues / 203
10.4 Additives / 207
10.5 Reinforcements / 209
10.6 Conductive Materials / 217
10.7 References / 224
Chapter 11. Properties of Base Materials Edward Kelley and Douglas Trobough
225
11.1 Introduction / 225
11.2 Thermal, Physical, and Me