![Reliability of RoHS-Compliant 2D and 3D IC Interconnects Reliability of RoHS-Compliant 2D and 3D IC Interconnects](https://bilder.buecher.de/produkte/31/31578/31578948m.jpg)
Gebundenes Buch
22. Dezember 2010
McGraw-Hill Professional
![Chip on Board Chip on Board](https://bilder.buecher.de/produkte/22/22024/22024472m.jpg)
Gebundenes Buch
Technology for Multichip Modules
1994.
30. Juni 1994
Springer / Springer US / Springer, Berlin
![Chiplet Design and Heterogeneous Integration Packaging (eBook, PDF) Chiplet Design and Heterogeneous Integration Packaging (eBook, PDF)](https://bilder.buecher.de/produkte/67/67685/67685752m.jpg)
eBook, PDF
27. März 2023
Springer Nature Singapore
Broschiertes Buch | 88,99 € | |
Gebundenes Buch | 125,99 € |
![Semiconductor Advanced Packaging (eBook, PDF) Semiconductor Advanced Packaging (eBook, PDF)](https://bilder.buecher.de/produkte/61/61902/61902958m.jpg)
eBook, PDF
17. Mai 2021
Springer Singapore
Broschiertes Buch | 81,99 € | |
Gebundenes Buch | 117,99 € |
![Fan-Out Wafer-Level Packaging (eBook, PDF) Fan-Out Wafer-Level Packaging (eBook, PDF)](https://bilder.buecher.de/produkte/52/52939/52939133m.jpg)
eBook, PDF
5. April 2018
Springer Singapore
Broschiertes Buch | 74,99 € | |
Gebundenes Buch | 103,99 € |
![Assembly and Reliability of Lead-Free Solder Joints (eBook, PDF) Assembly and Reliability of Lead-Free Solder Joints (eBook, PDF)](https://bilder.buecher.de/produkte/59/59555/59555031m.jpg)
eBook, PDF
29. Mai 2020
Springer Singapore
Broschiertes Buch | 85,99 € | |
Gebundenes Buch | 119,99 € |
![Chiplet Design and Heterogeneous Integration Packaging Chiplet Design and Heterogeneous Integration Packaging](https://bilder.buecher.de/produkte/70/70263/70263267m.jpg)
Broschiertes Buch
2023
29. März 2024
Springer / Springer Nature Singapore / Springer, Berlin
978-981-19-9919-2
![Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology](https://bilder.buecher.de/produkte/70/70021/70021946m.jpg)
Gebundenes Buch
2024
24. Mai 2024
Springer / Springer Nature Singapore / Springer, Berlin
978-981-97-2139-9
![Chiplet Design and Heterogeneous Integration Packaging Chiplet Design and Heterogeneous Integration Packaging](https://bilder.buecher.de/produkte/66/66991/66991176m.jpg)
Gebundenes Buch
2023
28. März 2023
Springer / Springer Nature Singapore / Springer, Berlin
978-981-19-9916-1
![Semiconductor Advanced Packaging Semiconductor Advanced Packaging](https://bilder.buecher.de/produkte/63/63809/63809390m.jpg)
Broschiertes Buch
1st ed. 2021
19. Mai 2022
Springer / Springer Nature Singapore / Springer, Berlin
978-981-16-1378-4
![Semiconductor Advanced Packaging Semiconductor Advanced Packaging](https://bilder.buecher.de/produkte/61/61243/61243743m.jpg)
Gebundenes Buch
1st ed. 2021
18. Mai 2021
Springer / Springer Nature Singapore / Springer, Berlin
978-981-16-1375-3
![Fan-Out Wafer-Level Packaging Fan-Out Wafer-Level Packaging](https://bilder.buecher.de/produkte/56/56479/56479033m.jpg)
Broschiertes Buch
Softcover reprint of the original 1st ed. 2018
16. Dezember 2018
Springer / Springer Nature Singapore / Springer, Berlin
978-981-13-4266-0
![Heterogeneous Integrations Heterogeneous Integrations](https://bilder.buecher.de/produkte/55/55231/55231545m.jpg)
Gebundenes Buch
1st ed. 2019
12. April 2019
Springer / Springer Nature Singapore / Springer, Berlin
978-981-13-7223-0
Ähnlichkeitssuche: Fact®Finder von OMIKRON