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Gebundenes Buch
22. Dezember 2010
McGraw-Hill Professional
![Chip on Board Chip on Board](https://bilder.buecher.de/produkte/22/22024/22024472m.jpg)
Gebundenes Buch
Technology for Multichip Modules
1994.
30. Juni 1994
Springer / Springer US / Springer, Berlin
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Broschiertes Buch
2023
29. März 2024
Springer / Springer Nature Singapore / Springer, Berlin
978-981-19-9919-2
Gebundenes Buch | 137,99 € | |
eBook, PDF | 97,95 € |
![Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology](https://bilder.buecher.de/produkte/70/70021/70021946m.jpg)
Gebundenes Buch
2024
24. Mai 2024
Springer / Springer Nature Singapore / Springer, Berlin
978-981-97-2139-9
eBook, PDF | 137,95 € |
![Chiplet Design and Heterogeneous Integration Packaging Chiplet Design and Heterogeneous Integration Packaging](https://bilder.buecher.de/produkte/66/66991/66991176m.jpg)
Gebundenes Buch
2023
28. März 2023
Springer / Springer Nature Singapore / Springer, Berlin
978-981-19-9916-1
![Semiconductor Advanced Packaging Semiconductor Advanced Packaging](https://bilder.buecher.de/produkte/63/63809/63809390m.jpg)
Broschiertes Buch
1st edition 2021
19. Mai 2022
Springer / Springer Nature Singapore / Springer, Berlin
978-981-16-1378-4
Gebundenes Buch | 129,99 € | |
eBook, PDF | 81,95 € |
![Semiconductor Advanced Packaging Semiconductor Advanced Packaging](https://bilder.buecher.de/produkte/61/61243/61243743m.jpg)
Gebundenes Buch
1st edition 2021
18. Mai 2021
Springer / Springer Nature Singapore / Springer, Berlin
978-981-16-1375-3
![Fan-Out Wafer-Level Packaging Fan-Out Wafer-Level Packaging](https://bilder.buecher.de/produkte/56/56479/56479033m.jpg)
Broschiertes Buch
Softcover reprint of the original 1st edition 2018
16. Dezember 2018
Springer / Springer Nature Singapore / Springer, Berlin
978-981-13-4266-0
Gebundenes Buch | 113,99 € | |
eBook, PDF | 73,95 € |
![Heterogeneous Integrations Heterogeneous Integrations](https://bilder.buecher.de/produkte/55/55231/55231545m.jpg)
Gebundenes Buch
1st edition 2019
12. April 2019
Springer / Springer Nature Singapore / Springer, Berlin
978-981-13-7223-0
eBook, PDF | 113,95 € |
![Fan-Out Wafer-Level Packaging Fan-Out Wafer-Level Packaging](https://bilder.buecher.de/produkte/51/51071/51071029m.jpg)
Gebundenes Buch
1st edition 2018
13. April 2018
Springer / Springer Nature Singapore / Springer, Berlin
978-981-10-8883-4
![Solder Joint Reliability Solder Joint Reliability](https://bilder.buecher.de/produkte/41/41319/41319949n.jpg)
Broschiertes Buch
Theory and Applications
Softcover reprint of the original 1st ed. 1991
23. Februar 2014
Springer / Springer US / Springer, Berlin
![Assembly and Reliability of Lead-Free Solder Joints Assembly and Reliability of Lead-Free Solder Joints](https://bilder.buecher.de/produkte/61/61822/61822739m.jpg)
Broschiertes Buch
1st edition 2020
30. Mai 2021
Springer / Springer Nature Singapore / Springer, Berlin
978-981-15-3922-0
Gebundenes Buch | 130,99 € | |
eBook, PDF | 89,95 € |
![Assembly and Reliability of Lead-Free Solder Joints Assembly and Reliability of Lead-Free Solder Joints](https://bilder.buecher.de/produkte/58/58694/58694485m.jpg)
Gebundenes Buch
1st edition 2020
30. Mai 2020
Springer / Springer Nature Singapore / Springer, Berlin
978-981-15-3919-0
![Handbook Of Tape Automated Bonding Handbook Of Tape Automated Bonding](https://bilder.buecher.de/produkte/20/20969/20969025m.jpg)
Gebundenes Buch
1992.
31. Januar 1992
Springer / Springer US / Springer, Berlin
978-0-442-00427-9
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